Taiwan Semiconductor Manufacturing Comp. Ltd.

Chin-Hsiang Chang

You-Hua Chou

Chen-Ming Huang

Shih-Chi Lin

Chih-Tsung Lee

Min Hao Hong

Chih-Jen Wu

Soon-Kang Huang

Chih-Yuan Yang

Kun-Tai Wu

A method of using a polishing system includes securing a wafer to a support, wherein the wafer has a first diameter. The method further includes polishing the wafer using a first polishing pad rotating about a first axis, wherein the first polishing pad has a second diameter greater than the first diameter. The method further includes rotating the support about a second axis perpendicular to the first axis after polishing the wafer using the first polishing pad. The method further includes polishing the wafer using a second polishing pad after rotating the support, wherein the second polishing pad has a third diameter less than the first diameter. The method further includes releasing the wafer from the support following polishing the wafer using the second polishing pad.

Method of using a polishing system

A polishing system includes a wafer support that holds a wafer, the wafer having a first diameter. The polishing system further includes a first polishing pad that polishes a first region of the wafer, the first polishing pad having a second diameter greater than the first diameter. The polishing system further includes an auxiliary polishing system comprising at least one second polishing pad that polishes a second region of the wafer, wherein the second polishing pad has a third diameter less than the first diameter, and the wafer support is configured to support the wafer during use of the first polishing pad and the auxiliary polishing system.

Polishing system

A polishing system for polishing a semiconductor wafer includes a wafer support for holding the semiconductor wafer, and a first polishing pad for polishing a region of the semiconductor wafer. The semiconductor wafer has a first diameter, and the first polishing pad has a second diameter shorter than the first diameter.

Polishing system and polishing method

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Taipei, Taiwan

Chin-Hsiang Chang