Taiwan Semiconductor Manufacturing Comp. Ltd.

Altek Corporation

Chih-Yuan Yang

Shih-Ho Lin

Yu-Chen Wei

You-Hua Chou

Chen-Ming Huang

Shih-Chi Lin

Chih-Tsung Lee

Min Hao Hong

Chih-Jen Wu

Soon-Kang Huang

Jen-Chieh Lai

Kun-Tai Wu

Chin-Hsiang Chang

Szu-Cheng Wang

Hong-Long Chou

Jheng-Si Su

Chun-Jui Chu

Jen Chieh Lai

Teng-Chun Tsai

Ying-Lang Wang

Huai-Tei Yang

Kuo-Yin Lin

Hsiang-Pi Chang

Miao-Cheng Liao

Chih-I Peng

Yu-Chen Huang

Cary Chia-Chiung Lo

Hung-Hsin Liang

Hsiang-Sheng Cheng

Li-Hsiang Chao

Sheng-Te Shu

A method includes depositing a slurry onto a polishing pad of a chemical mechanical polishing (CMP) station. A workpiece is polished and polishing by-products and slurry are removed from the polishing pad by a vacuum head. A CMP apparatus includes a polishing pad configured to rotate during a CMP process. The apparatus also includes a slurry dispenser configured to deposit a slurry onto a polishing surface of the polishing pad. The apparatus further includes a momentum vacuum assembly including a slotted opening facing the polishing surface of the polishing pad. The apparatus also includes a first suction line coupled to an upper portion of the momentum vacuum assembly and leading to a first vacuum source, the first suction line configured to transport polishing products which have been removed from the polishing pad through the slotted opening.

Vacuum assembly for chemical mechanical polishing

A method of using a polishing system includes securing a wafer in a carrier head, the carrier head including a housing enclosing the wafer, in which the housing includes a retainer ring recess and a retainer ring positioned in the retainer ring recess, the retainer ring surrounding the wafer, in which the retainer ring includes a main body portion and a bottom portion connected to the main body portion, and a bottom surface of the bottom portion includes at least one first engraved region and a first non-engraved region adjacent to the first engraved region; pressing the wafer against a polishing pad; and moving the carrier head or the polishing pad relative to the other.

Method and system for performing chemical mechanical polishing

A method of using a polishing system includes securing a wafer to a support, wherein the wafer has a first diameter. The method further includes polishing the wafer using a first polishing pad rotating about a first axis, wherein the first polishing pad has a second diameter greater than the first diameter. The method further includes rotating the support about a second axis perpendicular to the first axis after polishing the wafer using the first polishing pad. The method further includes polishing the wafer using a second polishing pad after rotating the support, wherein the second polishing pad has a third diameter less than the first diameter. The method further includes releasing the wafer from the support following polishing the wafer using the second polishing pad.

Method of using a polishing system

A transporter for transporting an article used in semiconductor fabrication is provided. The transporter includes a robotic arm. The transporter further includes two platens connected to the robotic arm. Each of the two platens an inner surface facing the other, and a number of gas holes are formed on each of the inner surfaces of the two platens. The transporter also includes a gas supplier placed in communication with the gas holes. The gas supplier is used to control the flow of gas through the gas holes.

Article transporter in semiconductor fabrication

A method for transporting an article used in semiconductor fabrication is provided. The method includes moving a first transporter next to an article to have the article faces a plurality of gas holes formed on the first transporter; suspending the article with the first transporter in a non-contact manner by providing a flow of gas through the gas holes of the first transporter; and transferring the article with the first transporter while the flow of gas is continuously provided.

Article transferring method in semiconductor fabrication

A polishing system includes a wafer support that holds a wafer, the wafer having a first diameter. The polishing system further includes a first polishing pad that polishes a first region of the wafer, the first polishing pad having a second diameter greater than the first diameter. The polishing system further includes an auxiliary polishing system comprising at least one second polishing pad that polishes a second region of the wafer, wherein the second polishing pad has a third diameter less than the first diameter, and the wafer support is configured to support the wafer during use of the first polishing pad and the auxiliary polishing system.

Polishing system

A chemical mechanical polishing (CMP) chamber is disclosed. The CMP chamber includes a chamber body, a door mounted on the chamber body and a chamber substructure being one selected from a group consisting of a moisture separator separating a moisture generated in the CMP chamber, a supplementary exhaust port, a transparent window mounted on the door, a sampling port mounted on the door, a sealing material including a metal frame, an o-ring for sealing the door and a combination thereof.

System and method for operating chemical mechanical polishing process

A polishing system for polishing a semiconductor wafer includes a wafer support for holding the semiconductor wafer, and a first polishing pad for polishing a region of the semiconductor wafer. The semiconductor wafer has a first diameter, and the first polishing pad has a second diameter shorter than the first diameter.

Polishing system and polishing method

A digital image composition method is adapted to eliminate a ghost image produced by a digital image-capturing apparatus due to handshakes in shooting. The method includes the steps. In a pre-shooting process, a base image and a comparison image are respectively captured. A base pixel is selected from the base image, and a core window is set with the base pixel at the center. A comparison pixel is selected from the comparison image, and a search window is set with the comparison pixel at the center. Each area of the search window is compared through the core window, and an absolute error sum value between the base image and the comparison image is calculated. It is determined how to change the brightness of the base pixel according to the normalized region difference value. The above steps are repeated to adjust each pixel in the base image.

Digital image composition method

A digital image processing method for correcting a shaking blur corrects a blurred image caused by a shake when a user shoots an image with a digital camera, which includes the following steps obtaining a safe shutter time of the digital camera; performing an exposure adjustment procedure, for adjusting an aperture and a ISO speed of the digital camera respectively, and obtaining a shutter time of the digital camera after being adjusted; performing a shooting procedure; shooting a plurality of digital images, if the shutter time of the digital camera is greater than the safe shutter time; and then performing an image compensation procedure according to the digital images, to align the same image object in the digital images and then to overlay each pixel of the digital images one by one, thereby outputting an output image.

Digital image processing method for correcting shaking blur

A preventive maintenance tool which may be installed on a metal chemical vapor deposition (CVD) chamber to prevent escape of contaminating and toxic gases from the chamber interior during preventative maintenance (PM) cleaning of the chamber. The tool comprises a cylindrical tool body which fits to the lid O-ring of the chamber to form a gas-tight seal therewith; a vacuum line connector nipple extending from the body for connection to a vacuum line; and a lid panel rotatably mounted in the body and fitted with a pair of hinged closing panels for reversibly sealing the chamber and facilitating chamber cleaning.

Preventative maintenance aided tool for CVD chamber

Growing community of inventors

Hsinchu, Taiwan

Chih-Yuan Yang