Taiwan Semiconductor Manufacturing Comp. Ltd.

Chih-Pen Yen

Jeng-Yann Tsay

Jeng-Chiang Chuang

Yung-Mao Hsu

Jenq-Yann Tsay

Yong-Mao Hsu

Cheng-Fang Lin

Chein-Fang Lin

A system for controlling the flow of gases into a reaction chamber used in processing semiconductor devices includes a safety interlock feature that prevents inadvertent mixing of incompatible, reactive gases. The interlock feature is implemented in an interlock control circuit which operates a valve system for individually controlling the flow of separate gases into the chamber. The interlock circuit includes a series of relay switches and timers arranged to create a time delay between the initiation of flow of gases from separate sources into the chamber.

Gas flow control system with interlock

A method and apparatus for detecting material accretion and peeling in a system such as a plasma process chamber, including multiple optical sensors which are provided in the chamber above a gas distribution plate or other surface inside the chamber. The optical sensors are connected to a central process controller that is capable of terminating operation of the chamber and may be equipped with an alarm. In the event that the optical sensors detect asymmetries in brightness or light reflection among various portions or regions of the gas distribution plate or other surface, which asymmetries may indicate the formation of a material coating on the plate or dislodging of contaminant particles from the plate, a signal is sent to the process controller, which may be adapted to terminate the plasma process, alert operating personnel, or both.

Method and apparatus for early detection of material accretion and peeling in plasma system

Detecting blade vibration via ultrasonic waves is disclosed. The blade may be part of a robot that is used in conjunction with semiconductor device fabrication. A process chamber is provided that has a sidewall and a base defining a cavity contained therein. A rotatable blade is mounted at a center of the cavity that has a base portion and a tip portion extensible from the center to the sidewall of the process chamber. One or more ultrasonic sensors are mounted on the base adjacent to the sidewall. Ultrasonic waves are sent and received toward and reflected by the tip portion of the wafer blade to determine the tip portion's position. In this way, vibrational movement of the blade can be detected.

Ultrasonic wafer blade vibration detecting

Growing community of inventors

Kaohsiung, Taiwan

Chih-Pen Yen