Mallinckrodt Baker, Inc.

Avantor Performance Materials, Inc.

Mallinckrodt, Inc.

Chien-Pin Sherman Hsu

Glenn Westwood

William R Gemmill

Paul A Bouis

Chu-Hung Wade Wei

Chun-Yi Sam Chiu

Mi Yeon Oh

Steven C Magee

Provided therefore herein is a novel acidic fluoride activated cleaning chemistry. The present invention includes novel acidic fluoride activated, unique organic-solvent based microelectronic selective etchant/cleaner compositions with high metal nitride etch and broad excellent compatibility, including tungsten (W) and low-k. It does not use W-incompatible oxidizers, such as hydrogen peroxide or particle-generating corrosion inhibitors.

Non-aqueous tungsten compatible metal nitride selective etchants and cleaners

Semi-aqueous, alkaline microelectronic cleaning composition of pH &#x2265;8 containing:

Microelectronic substrate cleaning compositions having copper/azole polymer inhibition

Cleaning compositions suitable for cleaning microelectronic structures having silicon dioxide, low-k or high-k di-electrics and copper or aluminum metallizations contain a polar organic solvent selected from amides, sulfones, sulfolenes, selenones and saturated alcohols and a strong alkaline base.

Microelectronic cleaning and arc remover compositions

A cleaning composition for cleaning microelectronic or nanoelectronic devices, the cleaning composition having HF as the sole acid and sole fluoride compound in the composition, at least one primary solvent selected from the group consisting of sulfones and selenones, at least one polyhydroxyl alkyl or aryl alcohol co-solvent having metal ion complexing or binding sites, and water, and optionally at least one phosphonic acid corrosion inhibitor compound and the is free of amines, bases and other salts.

Multipurpose acidic, organic solvent based microelectronic cleaning composition

Nanoelectronic and microelectronic cleaning corn positions for cleaning nanoelectronic and microelectronic substrates under supercritical fluid state conditions, and particularly cleaning compositions useful with and having improved compatibility with nanoelectronic and microelectronic substrates characterized by silicon dioxide, sensitive low-n or high-K dielectrics and copper, tungsten, tantalum, nickel, gold, cobalt, palladium, platinum, chromium, ruthenium, rhodium, iridium, hafnium, titanium, molybdenum, tin and other metallization, as well as substrates of A1 or Al(Cu) metallizations and advanced interconnect technologies, are provided by nanoelectronic and microelectronic cleaning compositions.

Nanoelectronic and microelectronic cleaning compositions

Ammonia-free, HF-free cleaning compositions for cleaning photoresist and plasma ash residues from microelectronic substrates, and particularly to such cleaning compositions useful with and having improved compatibility with microelectronic substrates characterized by sensitive porous and low-&#x3ba; to high-&#x3ba; dielectrics and copper metallization. The cleaning composition contain one or more non-ammonium producing, non-HF producing fluoride salt (non ammonium, quaternary ammonium fluoride salt) in a suitable solvent matrix.

Microelectronic cleaning compositions containing ammonia-free fluoride salts for selective photoresist stripping and plasma ash residue cleaning

Microelectronic cleaning compositions for cleaning microelectronic substrates, and particularly cleaning compositions useful with and having improved compatibility with microelectronic substrates characterized by silicon dioxide, sensitive low-&#x3ba; or high-&#x3ba; dielectrics and copper, tungsten, tantalum, nickel, gold, cobalt, palladium, platinum, chromium, ruthenium, rhodium, iridium, hafnium, titanium, molybdenum, tin and other metallization, as well as substrates of Al or Al(Cu) metallizations and advanced interconnect technologies, are provided by microelectronic cleaning compositions comprising halogen acids, salts and derivatives thereof.

Microelectronic cleaning composition containing halogen oxygen acids, salts and derivatives thereof

Cleaning compositions suitable for cleaning microelectronic structures having silicon dioxide, low-k or high-k dielectrics and copper or aluminum metallizations contain an oxidizing agent and a polar organic solvent selected from amides, sulfones, sulfolenes, selenones and saturated alcohols, and optionally other components.

Microelectronic cleaning compositions containing oxidizers and organic solvents

Ammonia-free cleaning compositions for cleaning microelectronic substrates, and particularly to such cleaning compositions useful with and having improved compatibility with microelectronic substrates characterized by sensitive porous, low-&#x3ba; and high-&#x3ba; dielectrics and copper metallization. Cleaning compositions for stripping photoresists, cleaning residues from plasma generated organic, organometallic and inorganic compounds, and cleaning residues from planarization processes. The cleaning composition contain one or more non-ammonium producing strong base containing non-nucleophilic, positively charged counter ions and one or more steric hindered amide solvents.

Ammonia-free alkaline microelectronic cleaning compositions with improved substrate compatibility

Ammonia-free, HF-free cleaning compositions for cleaning photoresist and plasma ash residues from microelectronic substrates, and particularly to such cleaning compositions useful with and having improved compatibility with microelectronic substrates characterized by sensitive porous and low-k to high-k dielectrics and copper metallization. The cleaning composition contain one or more non-ammonium producing, non-HF producing fluoride salt (non ammonium, quaternary ammonium fluoride salt) in a suitable solvent matrix.

Microelectronic cleaning compositions containing ammonia-free fluoride salts

An electrophoresis container apparatus having (1) a primary container tray made from a UV light transmitting materials, (2) a UV light transmitting gel contained in the primary container tray, and (3) a removable top sheet for covering the gel. The removable top sheet may also be UV light transmitting. The apparatus optionally comes with a handle having pincers for grasping the primary container and permitting easy movement of the apparatus from location to location. Because the apparatus transmits UV light, the gel can be used and analyzed while it is still in the tray. This eliminates the need to remove the gel before analysis and reduces the chances that the gel will be damaged during handling. Similarly, because the apparatus has an optional handle, the user can move the apparatus form location to location without touching the apparatus and exposing the user to dangerous chemicals, e.g., those often used in staining procedures.

Growing community of inventors

Basking Ridge, NJ, United States of America

Chien-Pin Sherman Hsu