Taiwan Semiconductor Manufacturing Comp. Ltd.

Chien-Hui Chen

Wen-Hao Cheng

Wei-Pin Changchien

Nan-Hsin Tseng

Peng-Ren Chen

Jyun-Hong Chen

Yi-Lin Chuang

Chin-Her Chien

Yun-Han Lee

Chin-Chou Liu

Ji-Jan Chen

Systematic fault localization systems and methods are provided which utilize computational GDS-assisted navigation to accelerate physical fault analysis to identify systematic fault locations and patterns. In some embodiments, a method includes detecting a plurality of electrical fault regions of a plurality of dies of a semiconductor wafer. Decomposed Graphic Database System (GDS) cross-layer clips are generated which are associated with the plurality of electrical fault regions. A plurality of cross-layer common patterns is identified based on the decomposed GDS cross-layer clips. Normalized differentials may be determined for each of the cross-layer common patterns, and locations of hotspots in each of the dies may be identified based on the determined normalized differentials.

Systems and methods for systematic physical failure analysis (PFA) fault localization

Among other things, an integrated circuit and method for routing electrical pathways of an integrated circuit is provided. The integrated circuit comprises a buffer chain coupling a first cell of the integrated circuit to a second cell of the integrated circuit. An electrical pathway coupling a first inverter of the buffer chain with a second inverter of the buffer chain extends through a first set of metal layers and is routed to form a pulse-like shape having an apex at a top layer of the first set.

Integrated circuit comprising buffer chain

A method includes electrically grounding a first plurality of metal bumps on a first surface of an interconnection component to a common ground plate. A voltage contrast (VC) image of a second plurality of metal bumps of the interconnection component is generated. Grey levels of the second plurality of metal bumps in the VC image are analyzed to find defect connections between the second plurality of metal bumps and respective ones of the first plurality of metal bumps.

Methods for detecting defect connections between metal bumps

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Jhu-Dong Township, Taiwan

Chien-Hui Chen