Entegris, Inc.

Other

Entegris Asia LLC

Chieh Ju Wang

Chia-Jung Hsu

Emanuel Israel Cooper

Sheng-Hung Tu

Li-Min Chen

Steven Lippy

Hsing-Chen Wu

WonLae Kim

Eric Hong

Wei Chun Wang

Lingyan Song

Makonnen Payne

A method of selectively removing aluminium oxide or nitride material from a microelectronic substrate, the method comprising contacting the material with an aqueous etching composition comprising: an etchant comprising a source of fluoride; and a metal corrosion inhibitor; wherein the composition has a pH in the range of from 3 to 8. Aqueous etching compositions and uses are also described.

Selectively etching materials

The disclosure relates to a cleaning composition that aids in the removal of post-etch residues and aluminum-containing material, e.g., aluminum oxide, in the production of semiconductors that utilize an aluminum-containing etch stop layer. The compositions have a high selectivity for post-etch residue and aluminum-containing materials relative to low-k dielectric materials, cobalt-containing materials and other metals on the microelectronic device.

Post-etch residue removal for advanced node beol processing

Semi-aqueous compositions useful for the selective removal of titanium nitride and/or photoresist etch residue materials relative to metal conducting, e.g., tungsten and copper, and insulating materials from a microelectronic device having same thereon. The semi-aqueous compositions contain at least one oxidant, at least one etchant, and at least one organic solvent, may contain various corrosion inhibitors to ensure selectivity.

Compositions and methods for selectively etching titanium nitride

Compositions useful for the selective removal of titanium nitride and/or photoresist etch residue materials relative to insulating materials from a microelectronic device having same thereon. The removal compositions contain at least one oxidant, one etchant, and one activator to enhance the etch rate of titanium nitride.

Anti-theft lockset is disclosed. Lock column and frame body are arranged in lock core. Outer side of lock column is matched with a long slot on the inner wall of lock shell. Inner side of lock column is provided with a crown pillar, and lock core is provided with a sliding chute for causing lock column to slide and a first through hole for causing frame body to move. Crown pillar is contacted with a first lock ball. Lock core is internally provided with lock ball holes matched with first and second lock balls. One end of the second lock ball is contacted with the frame body. The lock core is provided with a containing slot for causing the first lock ball and a locking plate to move up and down. The containing slot is communicated with a key hole. The locking plate is provided with a second through hole.

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Hsin-Chu, Taiwan

Chieh Ju Wang