Au Optronics Corporation

Taiwan Semiconductor Manufacturing Comp. Ltd.

Chieh-Jen Cheng

Hsin-An Chang

Chia-Hun Cheng

Li-Jui Chen

Yao-An Mo

Shang-Chieh Chien

Jeng-Horng Chen

Yu-Chih Huang

Chia-Chen Chen

Po-Hung Chen

Yu-Kai Chiou

Anthony Yen

Shih-Yao Lin

Shinn-Sheng Yu

Chih-Tsung Shih

Chi-Lun Lu

Shu-Hao Chang

Ssu-Yu Chen

Che-Chang Hsu

Jui-Ching Wu

Ming-Chin Chien

Wei-Chih Lai

Yi-Fan Lin

Ta-Jen Huang

Chien-Ting Liao

Hung-Chuo Lee

Chao-Chen Chang

Ming-Ji Hsu

Hsin-Chang Chiang

Chia-Chang Yang

Kang-Wei Cheng

Cleaning equipment for an EUV wafer chuck or clamp, which removes particles that have accumulated between burls on the surface of the wafer chuck. The equipment includes a spinning bi-polar electrode placed in proximity to the surface, which can attract and adsorb the charged particle residue therefrom using its generated symmetric electric field when the wafer chuck is not in use.

Method and apparatus for removing contamination

An illuminator includes a first facet mirror receiving and reflecting an exposure radiation, an adjustable shielding element disposed on the first facet mirror, the adjustable shielding element adjusting intensity uniformity of the exposure radiation reflected by the first facet mirror, and a second facet mirror receiving and reflecting the exposure radiation reflected by the first facet mirror.

Photolithography device having illuminator and method for adjusting intensity uniformity

A method of removing particles from a surface of a reticle is disclosed. The reticle is placed in a carrier, a source gas is flowed into the carrier, and a plasma is generated within the carrier. Particles are then removed from a surface of the reticle using the generated plasma. A system of removing particles from a surface includes a carrier configured to house a reticle, a reticle stocker including the carrier, a power supply configured to apply a potential between an inner cover and an inner baseplate of the carrier, and a gas source configured to flow a gas into the carrier. A plasma may be generated within the carrier, and particles can be removed from a surface of the reticle using the generated plasma. An acoustic energy source configured to agitate at least one of the source gas and the generated plasma may be provided to facilitate particle removal using an agitated plasma.

Particle removal system and method thereof

Systems and methods for monitoring the focus of an EUV lithography system are disclosed. Another aspect includes a method having operations of measuring a first shift value for a first patterned set of sub-structures of a focus test structure on a wafer and measuring a second shift value for a second patterned set of sub-structures of the test structure on the wafer. The test structure may be formed on the wafer using asymmetric illumination, with the first patterned set of sub-structures having a first pitch and the second patterned set of sub-structures having a second pitch that is different from the first pitch. The method may further include determining a focus shift compensation for an illumination system based on a difference between the first shift value and the second shift value.

EUV focus monitoring systems and methods

A backlight module includes a light guide plate, a light source module, a supporting frame, and a heat conductive glue layer. The light guide plate has a light-entering end; the light source module is disposed corresponding to the light-entering end and includes a flexible circuit board and a plurality of light sources. The flexible circuit board extends along the light-entering end and has a light source-bearing area and a heat-dissipating area, wherein a width of the heat-dissipating area in a direction perpendicular to the light-entering end is not smaller than a width of the light source-bearing area. The plurality of light sources are disposed in the light source-bearing area. The supporting frame has a holding portion which is bent to form an accommodation space for accommodating the light source module and the light-entering end. The heat conductive glue layer is disposed between the heat-dissipating area and an inner side of the holding portion for conducting heat from the heat-dissipating area to the holding portion.

Backlight module and thermal design thereof

A light module and an assembling method thereof are disclosed. The light module includes a first circuit board, a second circuit board, and a light source, wherein the first circuit board has a first opening and a second opening, and the second circuit board has a first bending portion. The light source is disposed on the first circuit board. The second circuit board passes through the first opening and the second opening of the first circuit board to form the first bending portion and the first circuit board and the second circuit board are fixed together to complete the light module assembling.

Light module, composite circuit board device used therein, and assembling method thereof

A display apparatus includes a panel module and a backlight module. The backlight module is disposed under the panel module. The backlight module includes a frame, a light guide plate, and a reflector. The frame supports the edge of the light guide plate. The reflector is disposed at the bottom of the light guide plate. The edge of the reflector and the edge of the frame horizontally form an engaging seam without overlapping, and the engaging seam is substantially in a serrated shape.

Display apparatus

A frame structure of a backlight module includes a body and a mold frame. A side wall surrounds a bearing surface of the body, and the side wall has at least one stopper and at least one positioning hole. A side edge of the mold frame has at least one positioning post. When the mold frame is disposed on the side wall, the side edge of the mold frame leans against the stopper, and the positioning post of the mold frame is embedded in the positioning hole.

Frame structure of backlight module

A flat panel display module is introduced herein, which principally includes an upper bezel, a liquid crystal panel, a frame, an optical film set and a printed circuit board assembly (PCBA), wherein various types electrical components mounted on the PCBA are capable of being completely or mostly accommodated within a caved structure constructed within the inside of the flat panel display module so as to reduce a thickness of the whole flat panel display module. Simultaneously, a better structural strength for the whole flat panel display module can be achieved therefore by closely stacking up the above-mentioned elements of the whole flat panel display module.

Flat panel display module

The present disclosure is a backlight module including a light guide plate, a supporter, and a light source module. The light guide plate has a light incident side. The supporter has a bottom plate, a sidewall, and a top plate corresponding to the bottom plate. The bottom plate extends from a first end of the sidewall toward the light guide plate, and the top plate extends along a second end of the sidewall toward the light guide plate. The length of the sidewall is longer than the length of the top plate, such that the top plate corresponding to the sidewall forms at least one breach to expose the second end of the sidewall. The bottom plate, the top plate, and the sidewall together form an accommodating space, and the light incident side of the light guide plate is disposed between the top plate and the bottom plate. The light source module is disposed in the accommodating space and partially exposed through the at least one breach. The light source module has at least one light emitting unit and a printed circuit board. The light emitting unit is disposed on the printed circuit board, such that an emitting surface of the light emitting unit can face the light incident side of the light guide plate.

Backlight module and display device using the same

A display device and a backlight module thereof are provided. The display device further includes a display panel having a display area. The backlight module is disposed under the display panel and includes a light source holder, a light source, and a light guide plate. The light source holder has a sidewall, a top plate, and a bottom plate, wherein the bottom plate partially overlaps the display area of the display device. The light guide plate is disposed corresponding to the display area of the display device and has one end located in an opening between the top plate and the bottom plate. A thermal isolating layer is interposed between the light guide plate and a portion of the bottom plate which corresponds to the display area. The perpendicular distance between the light guide plate and the portion of the bottom plate overlapping the thermal isolating layer is greater than a perpendicular distance between the light guide plate and the other portion of the bottom plate.

Display device and backlight module with thermal isolating layer

Growing community of inventors

Hsin-Chu, Taiwan

Chieh-Jen Cheng