Taiwan Semiconductor Manufacturing Comp. Ltd.

National Science Council

Chia-Pin Lin

Wei-Yang Lee

Yuan-Ching Peng

Feng-Ching Chu

Tzu-Hua Chiu

Chih-Hao Yu

Hsien-Chin Lin

Wei-Han Fan

Ting-Yeh Chen

Shyue-Shyh Lin

Che-Lun Chang

Yen-Ting Chen

Chien-Tai Chan

Po-Yu Lin

Kuan-Hao Cheng

Wei-Yuan Lu

Da-Wen Lin

I-Hsieh Wong

Wei-Jen Lai

Bone-Fong Wu

Shih-Chiang Chen

Tian-Choy Gan

Kuang-Yuan Hsu

Sheng-Hsiung Wang

Peng-Soon Lim

Bo-Yu Lai

Fan-Yi Hsu

Yee-Chia Yeo

Yu-Lien Huang

Kuo-Feng Yu

King-Yuen Wong

Chien-I Kuo

Hsien-Hsin Lin

Chien-Wei Lee

Wen-Sheh Huang

Wei-Min Liu

Wei Hao Lu

Chih-Hsiang Huang

Hung-Kai Chen

Chun-Liang Tai

Jin-Mu Yin

Chia-Yu Lu

LI-Li Su

Li-Shiun Chen

Chung-Chi Wen

Shin Hsien Liao

Yi-Cheng Tsai

Chia-Lung Hung

Chih-Chiang Chang

Chii-Horng Li

Kuan-Ting Pan

Chung-Cheng Wu

Li-Li Su

Jiun-Ming Kuo

Huang-Chung Cheng

Wen-Kai Lin

Ming-Lung Cheng

An-Shen Chang

Yan-Ting Lin

Yen-Po Lin

Szu-Wei Tseng

Jyun-Chih Lin

Po-Shao Lin

Li-Wen Weng

Tzu-Wei Kao

Bang-Ting Yan

Chih-Hung Tseng

Alex Lee

Po Shao Lin

Ya-Jou Hsieh

Fu-Gom Tarntair

In a method of manufacturing a semiconductor device, a fin structure in which first semiconductor layers and second semiconductor layers are alternately stacked is formed over a substrate, a sacrificial gate structure is formed over the fin structure, a source/drain region of the fin structure is etched thereby forming a source/drain space, ends of the first semiconductor layers is laterally etched, an insulating layer is formed on a sidewall of the source/drain space, the insulating layer is partially etched, thereby forming one or more inner spacers on an etched end face of each of one or more first semiconductor layers and leaving a part of the insulating layer as a remaining insulating layer, and a source/drain epitaxial layer is formed in the source/drain space. After the source/drain epitaxial layer is formed, an end face of at least one of the second semiconductor layers is covered by the remaining insulating layer.

Methods of manufacturing semiconductor devices and semiconductor devices

A semiconductor structure includes an isolation structure; first and second source/drain (S/D) features over the isolation structure, defining a first direction from the first S/D feature to the second S/D feature from a top view; one or more channel layers connecting the first and the second S/D features; a gate structure between the first and the second S/D features and engaging each of the one or more channel layers; and a via structure under the first S/D feature and electrically connecting to the first S/D feature. In a cross-sectional view perpendicular to the first direction, the via structure has a profile that widens and then narrows along a bottom-up direction.

Epitaxial source/drain feature with enlarged lower section interfacing with backside via

A device a includes a substrate, two source/drain (S/D) features over the substrate, and semiconductor layers suspended over the substrate and connecting the two S/D features. The device further includes a dielectric layer disposed between two adjacent layers of the semiconductor layers and an air gap between the dielectric layer and one of the S/D features, where a ratio between a length of the air gap to a thickness of the first dielectric layer is in a range of 0.1 to 1.0.

Method and structure for air gap inner spacer in gate-all-around devices

A semiconductor device structure is provided. The semiconductor device structure includes a stack of channel structures and a first epitaxial structure and a second epitaxial structure adjacent to opposite sides of the channel structures. The semiconductor device structure also includes a gate stack wrapped around the channel structures and a backside conductive contact connected to the second epitaxial structure. The second epitaxial structure is between a top of the backside conductive contact and a top of the gate stack. The semiconductor device structure further includes an etch stop layer extending along a sidewall of the backside conductive contact and a bottom of the gate stack.

Semiconductor device structure with backside contact

A method includes forming a semiconductor fin protruding from a substrate, forming a dummy gate structure across the semiconductor fin, recessing a portion of the semiconductor fin in a region adjacent the dummy gate structure to form a recess, growing a semiconductor layer in the recess, and forming a first dielectric layer interposing the semiconductor layer and the dummy gate structure. The semiconductor layer covers at least a portion of the first dielectric layer. The method also includes modifying a shape of the semiconductor layer to expose the portion of the first dielectric layer, depositing a second dielectric layer covering the semiconductor layer and the portion of the first dielectric layer, and replacing the dummy gate structure with a metal gate structure.

Epitaxial features in semiconductor devices and manufacturing method of the same

A semiconductor device structure is provided. The semiconductor device structure includes a substrate having a base and a fin over the base. The semiconductor device structure includes a gate stack over a top portion of the fin. The semiconductor device structure includes a first nanostructure over the fin and passing through the gate stack. The semiconductor device structure includes a second nanostructure over the first nanostructure and passing through the gate stack. The first nanostructure is thicker than the second nanostructure. The semiconductor device structure includes a stressor structure over the fin and connected to the first nanostructure and the second nanostructure.

Semiconductor device structure and method for forming the same

A method includes providing a structure having a substrate, fins and an isolation structure over the substrate, wherein each fin includes first and second semiconductor layers alternatingly stacked. The method further includes depositing a first dielectric layer over top and sidewalls of the fins and over a top surface of the isolation structure; depositing a second dielectric layer over the first dielectric layer; and etching back the first and the second dielectric layers such that they remain on the top surface of the isolation structure and are removed from the top and sidewalls of the fins. The method further includes forming dummy gate stacks, gate spacers, source and drain trenches, and inner spacers, wherein the first and the second dielectric layers remain on the top surface of the isolation structure.

Isolation structures in multi-gate field-effect transistors

A semiconductor device includes a base portion on a semiconductor substrate, a channel layer vertically above the base portion and extending parallel to a top surface of the semiconductor substrate, a gate portion between the channel layer and the base portion, a source/drain feature connected to the channel layer, an inner spacer between the source/drain feature and the gate portion, and an air gap between the source/drain feature and the semiconductor substrate. Moreover, a bottom surface of the source/drain feature is exposed in the air gap.

Spacer features for nanosheet-based devices

A semiconductor device structure and a method for forming a semiconductor device structure are provided. The semiconductor device structure includes a stack of channel structures over a semiconductor fin and a gate stack wrapped around the channel structures. The semiconductor device structure also includes a source/drain epitaxial structure adjacent to the channel structures and an isolation structure surrounding the semiconductor fin. A protruding portion of the semiconductor fin protrudes from a top surface of the isolation structure. The semiconductor device structure further includes an embedded epitaxial structure adjacent to a first side surface of the protruding portion of the semiconductor fin.

Structure and formation method of semiconductor device with embedded epitaxial structure

In a method of manufacturing a semiconductor device, a fin structure, which includes a stacked layer of first semiconductor layers and second semiconductor layers disposed over a bottom fin structure and a hard mask layer over the stacked layer, is formed. An isolation insulating layer is formed. A sacrificial cladding layer is formed over at least sidewalls of the exposed hard mask layer and stacked layer. A first dielectric layer is formed. A second dielectric layer is formed over the first dielectric layer. The second dielectric layer is recessed. A third dielectric layer is formed on the recessed second dielectric layer. The third dielectric layer is partially removed to form a trench. A fourth dielectric layer is formed by filling the trench with a dielectric material, thereby forming a wall fin structure.

Method of manufacturing a semiconductor device and a semiconductor device

A method of manufacturing an integrated circuit (IC) includes providing a structure having a fin over a substrate in a region of the IC, a sacrificial gate stack engaging a channel region of the fin, and gate spacers on sidewalls of the sacrificial gate stack. The first layers and the second layers are alternately stacked over the substrate. The method also includes etching the fin adjacent the gate spacers, resulting in source/drain trenches, partially recessing the second layers exposed in the source/drain trenches, resulting in gaps between adjacent layers of the first layers in the fin, depositing inner spacer features in the gaps in the fin, epitaxially growing source/drain features in the source/drain trenches, and replacing the sacrificial gate stack with a metal gate stack. The metal gate stack includes a gate dielectric layer disposed over top and sidewalls of the fin having both the first and the second layers.

Semiconductor structure with gate-all-around devices and stacked FinFET devices

A semiconductor device and a method of forming the same are provided. In an embodiment, an exemplary semiconductor device includes a vertical stack of channel members disposed over a substrate, a gate structure wrapping around each channel member of the vertical stack of channel members, and a source/drain feature disposed over the substrate and coupled to the vertical stack of channel members. The source/drain feature is spaced apart from a sidewall of the gate structure by an air gap and a dielectric layer, and the air gap extends into the source/drain feature.

Inner spacer features for multi-gate transistors

Embodiments utilize a two layer inner spacer structure during formation of the inner spacers of a nano-FET device. The materials of the first inner spacer layer and second inner spacer layer can be selected to have a mismatch in their coefficients of thermal expansion (CTE). As the structure cools after deposition, the inner spacer layer which has a larger CTE will exhibit compressive stress on the other inner spacer layer, however, because the two layers have a common interface, the layer with the smaller CTE will exhibit a counter acting tensile stress.

Nano-FET semiconductor device and method of forming

A semiconductor device includes a fin stack, a gate structure on the fin stack, a source region on a first side of the gate structure, a drain region on a second side of the gate structure opposite the first side, and a source contact extending to and connecting the source region. The source region and the drain region are asymmetric.

Asymmetric source/drain for backside source contact

A semiconductor device structure is provided. The semiconductor device structure includes a substrate having a base and a fin structure over the base. The semiconductor device structure includes an isolation structure over the base and surrounding a lower portion of the fin structure. The semiconductor device structure includes a gate stack wrapped around an upper portion of the fin structure. The semiconductor device structure includes a source/drain structure partially embedded in the isolation structure and the lower portion of the fin structure. The source/drain structure has an undoped semiconductor layer and a first doped layer over the undoped semiconductor layer, and the undoped semiconductor layer separates the first doped layer from the isolation structure.

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Xinpu, Taiwan

Chia-Pin Lin