Semiconductor Manufacturing International (shanghai) Corporation

Shanghai Huali Microelectronics Corporation

Chengcheng Wang

Qiwei Wang

Rong Zou

The present invention discloses a flash. A channel region comprises a first shallow trench formed in the surface area of a semiconductor substrate. A tunneling dielectric layer and a polysilicon floating gate are formed in the first shallow trench and extended to the outside of the first shallow trench. A control dielectric layer and a polysilicon control gate are sequentially formed on the two side surfaces in the width direction and the top surface of the polysilicon floating gate. A source region and a drain region are formed in a self-aligned manner in active regions on the two sides in the length direction of the polysilicon floating gate. The present invention further discloses a method for manufacturing a flash. The present invention can break through the limitation of the length of the channel on the size of the memory cell, thus reducing the area of the memory cell.

Flash with shallow trench in channel region and method for manufacturing the same

A source-drain structure and method of manufacturing the same are disclosed. The source-drain structure includes a substrate containing a drain region and a source region. The drain region includes a lightly-doped ultra-shallow junction and a heavily-doped region, and a drain-substrate junction disposed in the vicinity of a junction between a side portion and a bottom portion of the lightly-doped ultra-shallow junction and the substrate, a plurality of impurity ions in the drain-substrate junction and a plurality of impurity ions in the lightly-doped ultra-shallow junction are opposite-conductivity type ions. The drain-substrate junction can smooth out the steep surface of the lightly-doped ultra-shallow junction to minimize the maximum electric field and reduce the ion flow close to the channel, and effectively reduce the inter-band tunneling hot electron effect.

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Shanghai, China

Chengcheng Wang