Taiwan Semiconductor Manufacturing Comp. Ltd.

Cheng-Liang Chang

Joung-Wei Liou

Chia-Hui Lin

Szu-An Wu

Ming-Te Chen

Chien-Feng Lin

Ray Chuang

Ying-Hsiu Tsai

Tsang-Yu Liu

Chi-Ching Lo

Huan-Wen Lai

Neo-Feng Chiou

Yen-Bo Huang

Yin-Ping Lee

Jen Wei

Chian-Kuo Huang

Ching-Sun Lee

Cheng-Yua Chuang

A high density plasma chemical vapor deposition process including exciting gas mixture to create a plasma including ions, and directing the plasma into a dense region above the upper surface of the semiconductor wafer, heating the wafer using an additional heat source, and allowing a material from the plasma to deposit onto the semiconductor wafer.

High aspect ratio gap fill application using high density plasma chemical vapor deposition

A disassembling device for separating a pedestal, a ceramic element and a base from an electrostatic chuck assembly. The base has a first end surface and a second end surface. The ceramic element is disposed on the first end surface. The pedestal is disposed on the ceramic element. The disassembling device includes a main body and at least one pushing element. The main body is disposed on the second end surface and has a through hole. The at least one pushing element penetrates the through hole and pushes against the ceramic element and pedestal to separate the ceramic element and pedestal from the first end surface of the base.

Electrostatic chuck assembly having disassembling device

Growing community of inventors

Hsing-Chu, Taiwan

Cheng-Liang Chang