Taiwan Semiconductor Manufacturing Comp. Ltd.

Cheng-Hung Lee

Hung-Jen Liao

Hau-Tai Shieh

Chi-Ting Cheng

Jhon-Jhy Liaw

Yen-Huei Chen

Jonathan Tsung-Yung Chang

Ching-Wei Wu

Chien-Yuan Chen

Hua-Hsin Yu

Hong-Chen Cheng

Kao-Cheng Lin

Wei-Min Chan

Jung-Ping Yang

Che-Ju Yeh

Hsiao-Tsung Yen

Chia-En Huang

Ping-Wei Wang

Chung-Cheng Chou

Feng-Ming Chang

Chiting Cheng

Ho-Hsiang Chen

Chin-Wei Kuo

Yu-Ling Lin

Chung-Yi Wu

Yu-Hao Hsu

Min-Chie Jeng

Fu-An Wu

He-Zhou Wan

Li-Wen Wang

Sahil Preet Singh

Wei-Jer Hsieh

Hsu-Shun Chen

Chia-Chen Kuo

I-Han Huang

Tsung-Hsien Huang

Kuang Ting Chen

Ming-Yi Lee

Wei-Yang Jiang

Manish Arora

Shu-Hsuan Lin

Hemant Patel

Sang Hoo Dong

Yang-Syu Lin

Circuit devices, such as integrated circuit devices, are constructed with combination circuits that include two or more cascading transistors, and one or more metal layers disposed over the cascading transistors. The cascading transistors include multiple internal nodes (e.g., common source/drain regions). The multiple internal nodes are not connected to a common metal stripe (the same metal stripe) in the one or more metal layers. The absence of the connections between the internal nodes and a common metal stripe reduce or eliminate the load on the internal nodes. The transistors in the cascading transistors are independent of each other.

Reducing internal node loading in combination circuits

A device is disclosed and includes an input stage circuit, a switching circuit, and a first latch circuit. The input stage circuit generates a first input signal having a first voltage and a second input signal based on a third input signal. The switching circuit operates in response to a first control signal, and adjusts a voltage level of a first data line according to the first input signal and a voltage level of a second data line according to the second input signal. The first latch circuit is coupled to the switching circuit by the first data line and the second data line. The first latch circuit latches a data in response to the first control signal and a second control signal, and adjusts the voltage level of the first data line based on a second voltage different from the first voltage.

Latch type sense amplifier

A computation apparatus includes a plurality of memory cells and a plurality of sense amplifiers, in which each of the memory cells includes a memory circuit and a calculation circuit. The memory circuits of the memory cells are configured to receive input values from a plurality of word lines, generate a computation result based on the input values and output the computation result to a bit line. The calculation circuits of the memory cells are configured to receive calculation input values from a plurality of calculation word lines, generate calculation output values based on the calculation input values, and output the calculation output values to a plurality of calculation bit lines. The sense amplifiers are configured to sense the calculation output values from the calculation bit lines to generate sensed values, wherein a value of the computation result is determined based on the sensed values and the calculation output values.

Computation apparatus and method using the same

A device disclosed includes first and second rows of memory cells, a first data line, and a first continuous data line. The first and second rows of memory cells are arranged in a first sub-bank and a second sub-bank, separated from the first sub-bank, respectively. The first data line is arranged across the first sub-bank and coupled to a first memory cell in the first row of memory cells. The first continuous data line includes a first portion arranged across the first sub-bank and a second portion arranged across the second sub-bank. The first continuous data line is coupled to a second memory cell in the second row of memory cells. The first portion of the first continuous data line is disposed in a first metal layer. The first data line and the second portion of the first continuous data line are in a second metal layer.

Memory device with strap cells

The disclosure is directed to a memory circuit, an electronic device, and a method of operating the memory circuit. According to an exemplary embodiment, the disclosure is directed to a memory circuit which includes not limited to a voltage equalizing circuit configured to equalize and pre-charge a first data line and a second data line to a reference voltage, a sense amplifier circuit configured to sense a binary data based on a relative voltage between the first data line and the second data line, a read-out latch circuit configured to receive the binary data which is to be transmitted to an external controller, and a write circuit configured to receive a first signal of the first data line and a second signal of the second data line so as to write the first signal to a first bit line and the second signal to a second bit line.

Memory circuit, electronic device having the memory circuit, and method of operating memory circuit

A power management circuit suitable for a memory device and a memory device is provided. The power management circuit includes a first logic circuit, a second logic circuit, and a transmission gate. The first logic circuit is configured to receive an inverted first input signal and a second input signal and generates a first output signal. The second logic circuit is configured to receive a first input signal and the second input signal and generates a second output signal. The transmission gate is configured to receive the first output signal and generates a control signal to at least one power transistor coupled between the power management circuit and the memory device. During a standby mode, the power transistor is turned on to make a first voltage equal to a predetermined voltage and during a sleep mode, the control signal is coupled to a first voltage. The predetermined voltage is greater than the first voltage.

Power management circuit in memory device

A device includes a memory array. The memory array includes a first sub-bank, a first strap cell coupled to the first sub-bank, and a first continuous data line. The first continuous data line includes a first portion and a second portion coupled to the first sub-bank via the first strap cell. The first portion of the first continuous data line is disposed above the first strap cell and the second portion of the first continuous data line is disposed above the first portion of the first continuous data line.

An operation assist circuit includes a precharge and equalization circuit, a first sharing switch and a second sharing switch. The precharge and equalization circuit is coupled between a first dummy bit line and a second dummy bit line of a dummy bit line pair and configured to precharge and equalize the first dummy bit line and the second dummy bit line. The first sharing switch is coupled between a first bit line of a bit line pair and the first dummy bit line of the dummy bit line pair. The first sharing switch is configured to control an electrical connection between the first bit line of the first bit line pair and the first dummy bit line of the dummy bit line pair according to a charge sharing control signal. The second sharing switch, coupled between a second bit line of the bit line pair and the second dummy bit line of the dummy bit line pair. The second sharing switch is configured to control an electrical connection between the second bit line of the bit line pair and the second dummy bit line of the dummy bit line pair according the charge sharing control signal.

Operation assist circuit, memory device and operation assist method

A device includes a memory array. The memory array includes a first sub-bank, a second sub-bank, a strap cell and a continuous data line. The strap cell is arranged between the first sub-bank and the second sub-bank. The continuous data line includes a first portion coupled to the first sub-bank and a second portion disposed across the second sub-bank. The first portion of the continuous data line and the second portion of the continuous data line are disposed at separate layers above the strap cell.

A semiconductor memory device comprising a plurality of memory cells configured to store digital data and an input multiplexer configured to enable the selection of a particular memory cell from the plurality of memory cells. The semiconductor memory device further comprises a read/write driver circuit configured to read data from the selected memory cell and write data to the selected memory cell, and a write logic block configured to provide logical control to the read/write driver circuit for writing data to the selected of memory cell. The read/write driver circuit may be coupled to the read/write input multiplexer by a data line and an inverted data line and the read and the write operations to the selected memory cell occur over the same data line and inverted data line.

Semiconductor memory device using shared data line for read/write operation

A device includes a memory array including a first sub-bank, a second sub-bank, a first strap cell and a data line. The first strap cell is arranged between the first sub-bank and the second sub-bank. The data line includes a first portion and a second portion. The first portion is arranged across the first sub-bank. The second portion is arranged across the second sub-bank, and is coupled to the first portion via the first strap cell.

A device includes a first strap cell, a first data line, and a second data line. The first strap cell is arranged between a first row of memory cells and a second row of memory cells in a memory array. A first portion of the first data line is configured to transmit data to or from a first memory cell in the first row of memory cells. The second data line and a second portion of the first data line are configured to transmit data to or from a second memory cell in the second row of memory cells.

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Hsinchu, Taiwan

Cheng-Hung Lee