Taiwan Semiconductor Manufacturing Comp. Ltd.

Chen-Liang Chang

Chin-Szu Lee

Chien-Chun Hu

Ju-Ru Hsieh

Yu-Shan Shih

Zong-Han Hu

Wei-Tuzo Lin

Po-Chia Chen

Shun-Yu Chuang

A wafer support device includes a susceptor, at least one lift pin, at least one lift pin support base and at least one pad. The susceptor has a bottom surface and a top surface configured to support a wafer. The susceptor has at least one through hole extending between the bottom surface and the top surface. The lift pin is at least partially telescopically received in the through hole of the susceptor. The lift pin support base has at least one coupling feature thereon. The pad is detachably coupled with the coupling feature and supports the lift pin.

Wafer support device and method for removing lift pin therefrom

A method of cleaning a wafer in semiconductor fabrication is provided. The method includes cleaning a wafer using a wafer scrubber. The method further includes moving the wafer scrubber into an agitated cleaning fluid. The method also includes creating a contact between the wafer scrubber and a cleaning stage in the agitated cleaning fluid. In addition, the method includes cleaning the wafer or a second wafer by the wafer scrubber after the wafer scrubber is cleaned by the agitated cleaning fluid.

Method and system for cleaning wafer and scrubber

Growing community of inventors

Taipei, Taiwan

Chen-Liang Chang