Aplex, Inc.

Mosel Vitelic Corporation

Charles J Regan

David E Weldon

Shu-Hsin Kao

Shou-sung Chang

Linh X Can

Gregory C Lee

Gregory A Appel

William F Lapson

Michael Leach

An improved wafer polishing machine is disclosed. In one embodiment, the wafer polishing machine has a movable polishing surface and a holder that holds an object, such as a semiconductor wafer, against the movable polishing surface. The holder includes a support structure that supports the object in contact with the polishing surface and an annular retaining ring that retains the object in alignment with the support structure. The retaining ring has a plurality of projections projecting inwardly from its inner circumference. The projections are evenly spaced around the inner circumference of the retaining ring. In one embodiment, the projections on the retaining ring define a circle with a diameter no less than the diameter of the object being polished. In an alternative embodiment, the retaining ring has a smooth, circular inner circumference formed from a flexible material which distends to from a continuous arc of contact with the wafer during polishing. Each retaining ring disclosed herein forms multiple points of contact or a continuous arc of contact between the retaining ring and the wafer, thereby reducing wafer buckling during polishing and improving surface uniformity.

Retaining ring for wafer polishing

A polishing head for a chemical mechanical polishing (CMP) apparatus. The polishing head includes a backplate, a retaining ring supported by the backplate, and a bladder member encircled by the retaining ring. The backplate of the polishing head comprises a driving plate biasedly coupled to a subcarrier by a bellows. The polishing head may further include a lift plate disposed on the subcarrier and beneath the bladder member. A method for polishing a substrate includes placing a substrate on the bladder member and positioning the substrate against a polishing pad such that the bladder member applies a selected pressure profile on the substrate.

Polishing head for a chemical mechanical polishing apparatus

A polishing tool uses a seal cavity containing a fluid that supports polishing pads against an object being polished. The boundaries of the cavity include a support structure, a portion of a polishing material, and a seal between the support structure and the polishing material. The polishing material moves relative to the support structure and seal. A variety of seal configurations can maintain the fluid within the cavity. In one embodiment the seal mechanism is a labyrinth seal including multiple ridges. In one embodiment, the seal mechanism is a face-sealing seal which includes a jacket with a u-shaped cross section with a compressible element positioned within it. The face-sealing seal is in a groove positioned outside of the cavity. Alternatively, the face-sealing seal forms the outer edge of the cavity. In a further embodiment, the seal is an o-ring seal positioned within a double dove-tailed groove.

Seal for polishing belt center support having a single movable sealed

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Moraga, CA, United States of America

Charles J Regan