Lam Research Corporation

Changyou Jing

Fred Egley

Oleksandr Mikhnenko

Eric A Pape

Christopher Kimball

Siyuan Tian

Benny Wu

Yuma Ohkura

Matthew Claussen

Slobodan Mitrovic

A controller including a voltage sensor coupled to a heater trace integrated in an electrostatic chuck, the voltage sensor configured to sense a voltage difference across the heater trace, wherein the heater trace is associated with a heater zone. The controller including a current sensor coupled to the heater trace and configured to sense a current in the heater trace. The controller including a resistance identifier configured to identify a resistance of the heater trace based on the voltage difference and the current that is sensed. The controller including a temperature correlator configured to approximate a temperature of the heater zone based on the resistance and a correlation function of the heater trace. The correlation function uses a temperature coefficient of resistance of the heater trace.

Electrostatic chuck heater resistance measurement to approximate temperature

A sensor probe includes an elongated body defining an inner cavity having an inner diameter. A printed circuit board is configured to be fitted within the inner cavity. A first temperature-sensing integrated circuit mounted at a first end of the printed circuit board. A cap is mounted to a first end of the elongated body adjacent to the first temperature-sensing integrated circuit. A housing is configured to receive a second end of the elongated body, wherein the housing is configured to be mounted to a baseplate of a substrate support.

RF immune sensor probe for monitoring a temperature of an electrostatic chuck of a substrate processing system

Systems and methods for identifying a single failure in a heater array and compensating for the failure are described. The methods include identifying two X buses and two Y buses of the heater array having a location of the failure. A confirmation of the single failure within the heater array is performed after identifying the two X and two Y buses. Once the single failure is confirmed, the location of the failure is identified. The methods include compensating for the single failure by adjusting a duty cycle of a heater at the location of the failure, adjusting additional duty cycles of heaters along the same X bus as the failed heater and the same Y bus as the failed heater, and maintaining remaining duty cycles of power provided to remaining heaters of the heater array.

Identification of and compensation for a failure in a heater array

Systems and methods of the disclosure perform in situ sensing and real time compensation of various non-uniformities in substrate processing systems. A plasma non-uniformity is sensed by determining a temperature distribution across a matrix of a plurality of micro-heaters disposed in the substrate support. Alternatively, the plasma non-uniformity is sensed by determining heat flux through the substrate support using the matrix heaters and one or more heaters used to heat one or more zones of the substrate support. The plasma non-uniformity is compensated by adjusting one or more parameters such as power supplied to the matrix heaters, RF power supplied to generate plasma, chemistry and/or flow rate of gas or gases used to generate plasma, settings of thermal control units or chillers, and so on. Additionally, non-uniformities inherent in the substrate support are sensed using the zone and matrix heaters and are compensated by adjusting the one or more parameters.

In situ real-time sensing and compensation of non-uniformities in substrate processing systems

A substrate support assembly comprises a first optical receiver, a power converter, a first circuit, and a first optical transmitter, all embedded in the substrate support assembly. The first optical receiver is configured to receive a first optical signal and a first optical data through a fiber optic cable. The power converter is configured to generate DC power based on the first optical signal and the first optical data received by the first optical receiver. The first circuit is configured to receive the DC power from the power converter and to receive a second data from a sensor disposed in the substrate support assembly in response to the first optical data. The first optical transmitter is configured to transmit the second data as a second optical data through the fiber optic cable.

Power and data transmission to substrate support in plasma chambers via optical fiber

Systems and methods for real-time control of temperature within a plasma chamber are described. One of the methods includes sensing a voltage in real time of a rail that is coupled to a voltage source. The voltage source supplies a voltage to multiple heater elements of the plasma chamber. The voltage that is sensed is used to adjust one or more duty cycles of corresponding one or more of the heater elements. The adjusted one or more duty cycles facilitate achieving and maintaining a temperature value within the plasma chamber over time.

Real-time control of temperature in a plasma chamber

A substrate processing system includes a processing chamber, a pedestal arranged in the processing chamber, and an electrostatic chuck (ESC) arranged on the pedestal. The ESC contains a printed circuit board assembly (PCBA) made up of a plurality of printed circuit board layers to mount circuitry that controls operation of the ESC. One or more of the printed circuit board layers includes a heater layer having one or more metal traces, which may be copper, to cover some or all of a surface of the heater layer sufficiently to provide heat to one or more of the remaining printed circuit board layers, to maintain the circuitry within a predetermined temperature range. The heat may be conducted directly among the various other printed circuit board layers, or may be conducted through vias in various ones of the printed circuit board layers.

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Livermore, CA, United States of America

Changyou Jing