Semes Co., Ltd.

Chang Suk Oh

Sang Eun Noh

Ki Sang Eum

Woo Sin Jung

Kisang Eum

Unkyu Kang

Provided is an apparatus for treating a substrate. In the exemplary embodiment, the apparatus for treating the substrate includes a cup configured to have a treating space with an opened upper portion; a support unit configured to support the substrate in the treating space; a liquid supply unit configured to have a treating liquid supply nozzle for supplying a treating liquid to the substrate supported by the support unit; and a nozzle standby port which is positioned outside treating space, provides a standby space in which the nozzle stands by before and after treating the substrate in the treating space, and has a cleaning member for cleaning the nozzle positioned in the standby space, wherein the nozzle standby port includes an insertion hole provided so that a nozzle tip of the treating liquid supply nozzle is insertable; and a spray member configured to spray a cleaning liquid to the nozzle tip inserted into the insertion hole, wherein an impact point of the cleaning liquid may be spaced apart from the center of the nozzle tip at a predetermined distance.

Nozzle standby port, apparatus for treating substrate including the same and method for cleaning nozzle using the same

The inventive concept relates to a substrate treating apparatus, and may include a substrate treating apparatus includes a rotatable spin head, a cup that surrounds the spin head, a cleaning jig seated on the spin head, and that discharges a cleaning liquid toward the cup through rotation of the spin head, and a nozzle unit located at an upper portion of the cleaning jig and that supplies the cleaning liquid to a center of an upper surface of the cleaning jig, and the cleaning jig includes spattering guide grooves formed to be recessed such that the cleaning liquid provided from the nozzle unit spatters toward the cup with a centrifugal force due to the rotation of the spin head.

Cleaning jig, substrate treating apparatus including the same, cleaning method of substrate treating apparatus

An apparatus for performing liquid treatment for a substrate is provided. The apparatus for performing the liquid treatment for the substrate may include a housing having a treatment space, a substrate support unit to support and rotate the substrate in the treatment space, a liquid feeding unit including a nozzle device including a central exhaust port and multiple first outer exhaust ports, which are provided in a shape of a ring to form a concentric circle with the central exhaust port to feed mutually different treating liquids onto the substrate through respective exhaust ports, and a controller to control the liquid feeding unit.

Growing community of inventors

Cheonan-si, South Korea

Chang Suk Oh