Nan Ya Technology Corporation

Chang-Chun Hsieh

Wu-Der Yang

Ching-Feng Chen

The present disclosure relates to a semiconductor structure and a method of manufacturing the semiconductor structure. The semiconductor structure includes a substrate including a first surface and a conductive trace extending over the substrate; a die disposed over the first surface of the substrate; a molding disposed over the first surface of the substrate and covering the die; and a metallic layer surrounding the molding and the substrate, wherein the metallic layer is electrically connected to at least a portion of the conductive trace exposed through the substrate.

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Huatan, Taiwan

Chang-Chun Hsieh