Samsung Electronics Co., Ltd.

Osong Medical Innovation Foundation, Korea University Research and Business Foundation

Chan Gi Jeon

Sujin Lee

Younghoon Sohn

Q-Han Park

Sung Yoon Ryu

Su-Hyun Gong

DongGun Lee

Seunghyeok Son

A semiconductor wafer inspection method is provided. The semiconductor wafer inspection method includes: providing a wafer with target and reference dies; obtaining a candidate image of a first region of the target die and a reference image of a second region of the reference die; performing an imaging process on the candidate image to obtain a high resolution candidate image including sub-pixels for each pixel of the candidate image; performing the imaging process on the reference image to obtain a high resolution reference image including sub-pixels for each pixel of the candidate image; shifting the high resolution reference image in units of the sub-pixels; obtaining a difference image based on a difference between the high resolution candidate image and the high resolution reference image; and detecting whether a defect signal generated based on the difference image exceeds a threshold value.

Method and system for inspecting semiconductor wafer and method of fabricating semiconductor device using the same

Growing community of inventors

Hwaseong-si, South Korea

Chan Gi Jeon