United Microelectronics Corp.

Other

C C Hsue

Sun-Chieh Chien

Tony Lin

Wei-Chung Chen

Jih-Wen Chou

Jason Jyh-shyang Jenq

A method of forming a local interconnect is provided. A semiconductor is provided. An isolation structure, a transistor and a conductive layer are formed on the substrate. A dielectric layer with an opening is formed over the substrate. A part of the dielectric layer is removed by a photolithography and etching process to form a via opening to expose a part of the gate of the transistor or a part of the conductive layer. A conformal barrier layer is formed in the via opening and overflows the dielectric layer. A conductive plug is formed in the via opening. The barrier layer is patterned to form a local interconnect.

Method of fabricating local interconnect

A method of field implantation. Using a photo-resist layer as a mask, a substrate is implanted with ions to forming a selectively distributed ion field.

Method of field implantation

A method of fabricating a capacitor on a semiconductor substrate. A barrier layer is formed over the substrate to serve as a bottom electrode of the capacitor. A dielectric layer is formed on the barrier layer. An upper electrode is formed on the dielectric layer. In addition, the method can be used in a dynamic random access memory.

Method of fabricating capacitor

A method for manufacturing a PMOS transistor. A gate terminal is formed over a substrate. Spacers are formed on the sidewalls of the gate terminal. A source/drain terminal is formed in the substrate on each side of the gate terminal, and then a metal silicide layer is formed over the top surface of the gate terminal and the substrate. The spacers are next removed. Using the metal silicide layer as a mask, a source/drain extension region is formed in the substrate between the gate terminal and the source/drain terminal. Similarly, using the metal silicide layer as a mask, an anti-punchthrough region is form in the substrate interior under the source/drain extension region.

Method for manufacturing PMOS transistor

A method for forming an amorphous silicon layer over the terminals of a MOS transistor. The method includes the steps of forming a mask layer having an opening that exposes the gate polysilicon layer over the MOS transistor. Next, using the mask layer as a mask, an inactive ion implant operation is carried out such that inactive ions are implanted into the gate polysilicon layer. Thereafter, again using the mask layer as a mask, a first heavy bombarding operation is carried out, implanting ions locally. Finally, the mask layer is removed and then a second heavy bombarding operation is carried out, implanting ions globally.

Method for a pre-amorphization

A dual port random access memory (RAM). The dual port random access memory includes four N-MOS transistors and four P-MOS transistors. Both the N-MOS and the P-MOS transistors are used as pass gates. More specifically, two N-MOS transistors are used as pass gate for a set of bit lines and two P-MOS transistors are used as a pass gate to another set of bit lines.

Dual port random access memory

A method for fabricating DRAM capacitor which includes forming a transistor having a source/drain regions and a gate electrode above a silicon substrate; then, forming sequentially a stack of layers including a first insulating layer, a second insulating layer, a third insulating layer and a hard mask layer over the transistor; subsequently, patterning and etching the hard mask layer. Thereafter, an oxide layer is formed over the hard mask layer, and then portions of the layers are etched to form a capacitor region over the oxide layer and a contact opening exposing a portion of the source/drain region. In the subsequent step, a conducting layer is formed over the oxide layer, the hard mask layer, the sidewalls of the contact opening and the exposed portion of the source/drain region. Next, a polishing method is used to remove the conducting layer above the oxide layer, and then the oxide layer is removed to form a lower electrode. A dielectric layer is then formed over the lower electrode, and finally an upper electrode layer is formed over the dielectric layer.

Growing community of inventors

Hsinchu, Taiwan

C C Hsue