Corning Incorporated

Byungchul Kim

Raymond Charles Cady

Gary Carl Weber

Timothy Michael Miller

Joseph William Soper

Hyun-Soo Choi

Christina Sue Bennett

Claire Renata Coble

A method of processing a substrate, with a first major surface of the substrate removably bonded to a first major surface of a first carrier and a second major surface of the substrate removably bonded to a first major surface of a second carrier, includes initiating debonding at a first location of an outer peripheral bonded interface between the substrate and the first carrier to separate a portion of the first carrier from the substrate. The method further includes propagating a first debond front from the first debonded location along a first direction extending away from the first debonded location by sequentially applying a plurality of lifting forces to the first carrier at a corresponding plurality of sequential lifting locations of the first carrier.

Methods for processing a substrate

Growing community of inventors

Asan, South Korea

Byungchul Kim