Samsung Electronics Co., Ltd.

Sungkyunkwan University

Lg Electronics Inc.

Yonsei University

Byung-Gook Kim

Jae-Hyuck Choi

Sang-hee Lee

Dong-gun Lee

Hee-Bom Kim

Jong-Keun Oh

Jin Hwan Choi

Jin Hyeock Choi

Kyoung-mi Kim

Seong-woon Choi

Hyung-ho Ko

Jin-su Kim

Ji-Beom Yoo

Dong-Wook Shin

Jun-Youl Choi

Seung-Jae Lee

Jung-Hoon Lee

Taesung Kim

Tae-Sung Kim

Jisoo Kim

Chan-Ik Park

Soo-Young Kim

Ji-Soo Kim

Sung-Ho Park

Jang-Won Lee

Mun Ja Kim

Chan-Uk Jeon

Il-Yong Jang

Hee-bom Kim

Dong-Hoon Chung

Sang-hyeon Lee

Sang-hyun Kim

Seon-Taek Kim

Hyunsook Hong

Won-Joo Park

Yong-Seok Jung

Hyung-Joo Lee

Myoung-soo Lee

Mun-Ja Kim

Seong-Woo Choi

Rae-won Yi

Hwan-Chul Jeon

Byoung-Kook Lee

Suk-Jong Bae

Sooyoung Kim

Jae-Won Lim

Hwan Chul Jeon

Seokgi Hong

Sang-Yong Yu

Seong-Yong Moon

Sung-won Kwon

Jintaek Kwon

Ji-hoon Na

Myeongjong Lee

Seuk-Hwan Choi

Jung-hwan Lee

Byoung-Hun Park

Jeong-Ahn Kwong

Kyoung-Noh Kim

Hak-seung Han

Man-Kyu Kang

A chemical supply structure includes a bar-shaped body having a plurality of chemical reservoirs in which a plurality of chemicals is individually stored such that the body partially crosses an underlying substrate, a bar-shaped nozzle protruded from a bottom surface of the body and injecting injection chemicals onto the substrate, a plurality of the chemicals being mixed into the injection chemicals, and a hydrophobic unit arranged on the bottom surface of the body and on a side surface of the nozzle such that a mixed solution mixed with the injection chemicals is prevented from adhering to the bottom surface and the side surface by controlling a contact angle of the mixed solution with respect to the bottom surface and the side surface.

Chemical supply structure and a developing apparatus having the same

A storage device includes a nonvolatile memory device, and a controller that manages a data encryption key (DEK). The DEK is used to encrypt data to be written in a storage space of the nonvolatile memory device by a first user and to decrypt data read from the storage space. The controller grants a second user authority to access the storage space by encrypting the DEK based on a Diffie-Hellman (DH) algorithm, grants a second user authority to access the encrypted DEK, and decrypts the encrypted DEK based on the DH algorithm.

Storage device sharing data encryption key as encrypted and operating method of storage device

A pellicle includes a pellicle frame, a pellicle membrane, and an attaching element, a first surface of the attaching element having exposed pores.

Method of detaching a pellicle from a photomask

A pellicle includes a pellicle membrane, which includes a porous thin film. The porous thin film includes a plurality of nanowires, which are arranged across one another to form a net structure. A photomask assembly includes the pellicle and a photomask, wherein the pellicle is fixed to a surface of the photomask.

Pellicle and photomask assembly including the same

A method of manufacturing a pellicle assembly, the method including attaching a carbon-containing thin film onto a transfer membrane in a wet atmosphere; attaching the carbon-containing thin film to a pellicle frame in a dry atmosphere while the carbon-containing thin film is attached onto the transfer membrane; and separating the transfer membrane from the carbon-containing thin film while the carbon-containing thin film is attached to the pellicle frame.

Method of manufacturing pellicle assembly and method of photomask assembly including the same

A photomask includes a transparent substrate, a mask pattern formed on the substrate, and a protective layer pattern covering side walls of the mask pattern, wherein a top of the protective layer pattern is exposed.

Method of manufacturing photomask

A method of inspecting a surface includes loading an inspection object on a stage of a multibeam inspection device configured to generate a beam array, and scanning a plurality of inspection areas of the inspection object at a same time with the beam array, wherein one of the first inspection areas is smaller than an area formed by a quadrangle connecting respective centers of corresponding four adjacent beams of the beam array, and an adjacent area of the one first inspection area is not scanned with the beam array.

Method of inspecting surface and method of inspecting photomask using the same

A method for measuring a critical dimension of a mask pattern, including generating a mask pattern using an optically proximity-corrected (OPC) mask design including at least one block; measuring a first critical dimension of a target-region of interest (target-ROI) including neighboring blocks having a same critical dimension (CD), in the mask pattern; determining a group region of interest including the target-ROI and at least one neighboring block adjacent to the target-ROI; measuring second CDs of the neighboring blocks of the group region of interest; and correcting a measuring value of the first CD using a measuring value of the second CDs.

Method for grouping region of interest of mask pattern and measuring critical dimension of mask pattern using the same

Pellicle and exposure mask including the same

Provided are photomasks, methods of fabricating the photomasks, and methods of fabricating a semiconductor device by using the photomasks, in which a critical dimension (CD) of a pattern of a specific region of the photomask is corrected to improve the distribution of CDs of the pattern formed on a wafer. The photomasks may include a substrate and a light-blocking pattern formed on the substrate that includes an absorber layer and an anti-reflection coating (ARC) layer. The light-blocking pattern may include at least one of a first corrected area in which a top surface of the absorber layer is exposed, and a second corrected area in which a correction layer is formed on the ARC layer.

Photomasks, methods of fabricating the photomasks, and method of fabricating semiconductor devices by using the photomasks

A method of patterning a photoresist layer includes forming a photoresist layer on a substrate, exposing the photoresist layer to light using a first light source so as to induce a chemical change in the photoresist layer, performing a post-exposure bake process on the photoresist layer, the post-exposure bake process including irradiating the photoresist layer with at least two shots of laser light from a second light source such that the photoresist layer is heated to a first temperature, and performing a developing process on the photoresist layer after the post-exposure bake process, the development process selectively removing a portion of the photoresist layer.

Methods of manufacturing photomasks, methods of forming photoresist patterns and methods of manufacturing semiconductor devices

A method of manufacturing a pellicle includes forming a membrane on a first surface of a substrate from a chemical reaction in which the substrate serves as a catalyst, forming a protective pattern on a second surface of the substrate, immersing the substrate in an etchant solution, such that a portion of the substrate exposed through the protective pattern is removed to form a frame, and replacing the etchant solution with a solvent.

Pellicles and methods of manufacturing the same

Photomask and method of manufacturing the same

An optical device for splitting a single beam to a plurality of beams and an exposure apparatus including the optical device are disclosed. The optical device includes a first DOE lens array including a plurality of first diffractive optical element (DOE) lenses that are two-dimensionally arranged on a first plane and a second lens array including a plurality of second DOE lenses arranged on a second plane parallel to the first plane so as to respectively correspond to the plurality of first DOE lenses. The first DOE lens array splits a first parallel beam into a plurality of second beams by condensing the first parallel beam and the second DOE lens array modifies the plurality of second beams into a plurality of third beams.

Optical device and exposure apparatus including the same

A method for manufacturing a photomask includes forming a photoresist film on a substrate, and forming a defect detecting pattern on the photoresist film. The defect detecting pattern has a first pattern elongated in a first direction and a second pattern overlapping one end of the first pattern and elongated in a second direction different from the first direction. The first pattern and the second pattern are formed using electron beams (e-beam) diffracted by a same amplifier.

Method for manufacturing photomask and photomask manufactured using the same

Growing community of inventors

Seoul, South Korea

Byung-Gook Kim