Samsung Electronics Co., Ltd.

Byung-Am Lee

Chang-Hoon Lee

Joo-Woo Kim

Byung-Seol Ahn

Jae-Sun Cho

Jin-Woo Lee

Sang-Kil Lee

Sung-man Lee

Young-Kyu Lim

Jung-Lan Lee

Kyu-Hong Lim

Yong-Wan Kim

Hyo-Sang Cho

Sung-Man Lee

A method and apparatus of classifying repetitive defects on a substrate is provided. Defects of dies on the substrate are sequentially compared with a predetermined reference die. Sets of coordinates are marked on the reference die which are corresponding to the position of the defects on the dies on the substrate. Then, repetitive defects are classified which are repeatedly marked in a specified region on the reference die.

Method and apparatus for classifying repetitive defects on a substrate

In a method of aligning a wafer, which is capable of precisely and rapidly aligning the wafer, and a wafer alignment apparatus using the method of aligning the wafer, a first wafer is aligned to form a first template pattern corresponding to an image of the first wafer. Image data of a second wafer is inputted. A kind of the second wafer is different from that of the first wafer. A second template pattern is formed by transforming the first template pattern in response to the image data of the second wafer. The second wafer is then aligned in response to the second template pattern. Accordingly, the template pattern is formed using the image data to align the wafer although wafers having different images are inspected, thereby rapidly forming the template pattern.

Method for aligning a wafer and apparatus for performing the same

An auto focusing method and apparatus for determining a focusing evaluation value, comparing the focusing evaluation value with an acceptance level of a preset focusing evaluation value, and iteratively focusing, while widening the depth of focus, when the focusing evaluation value is lower than the acceptance level.

Auto focusing apparatus and method

A wafer pattern inspecting apparatus and method are disclosed. The apparatus comprises an image sensor to acquire image data from a reference die and a sample die, an external memory to store the image data, an encoder to compress the data, a decoder to decompress the data, an internal memory device to store the compressed image data of the reference die, an arithmetic module to process the image data for the reference dies to extract a reference image data, a reference storage memory to store compressed reference image data, and a comparison module to compare the sample die image data with the reference image data to an extract defect data for the sample die.

Apparatus and method for inspecting patterns on wafers

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Gyeonggi-do, South Korea

Byung-Am Lee