Samsung Electronics Co., Ltd.

Byeonghwan Jeon

Kwang Soo Kim

Youngduk Kim

Sangbong Park

Janghee Lee

Sangyun Lee

Sungho Jang

Taejoong Kim

Yongsuk Choi

Taeseok Oh

Youngkyu Park

Yong-Ho Choi

Yoo Jin Jeong

Disclosed are an apparatus for and a method of performing an inspection and metrology process. The apparatus may include a stage configured to load a substrate thereon, a sensor on the stage, an object lens between the sensor and the stage, a light source generating an illumination light to be transmitted to the substrate through the object lens, a first band filtering part between the light source and the object lens to control a wavelength of the illumination light within a first bandwidth, and a second band filtering part between the light source and the object lens to control a wavelength of the illumination light within a second bandwidth, which is smaller than the first bandwidth.

Apparatus for and method of performing inspection and metrology process

An inspection apparatus includes a light source device providing incident light to a substrate, an objective lens receiving reflection light reflected from the substrate, a light splitting device disposed over the objective lens, first and second optical sensors disposed at both sides of the light splitting device, respectively, and first and second spatial filters disposed between the first optical sensor and the substrate and between the second optical sensor and the substrate, respectively. The first and second spatial filters transmit the reflection light in different forms from each other.

Inspection apparatus, semiconductor device manufacturing system including the same, and method of manufacturing a semiconductor device using the same

An inspection device includes a first processor, a second processor, and a server. The first processor detects first coordinates of first feature points from first images in a first image set. The second processor detects second coordinates of second feature points from second images in a second image set. The server generates reference coordinates based on the first coordinates and the second coordinates. The reference coordinates are transmitted to the first processor and the second processor. The first and second image sets correspond to scanned swaths on a wafer.

Inspection device for inspecting wafer and method of inspecting wafer using the same

An optical inspection apparatus includes an inspection target unit on which an inspection target is loaded, an illumination optical unit configured to irradiate incident light to the inspection target, an objective lens unit disposed between the illumination optical unit and the inspection target unit, a detection optical unit configured to receive reflective light reflected from the inspection target to thereby detect a presence or absence of a defect on the inspection target, and a control unit configured to control the illumination optical unit and the detection optical unit. The illumination optical unit includes a light source part configured to irradiate the incident light, and a spatial filter array configured to modify a transmission region of the incident light irradiated from the light source part. The spatial filter array includes a spatial filter part, and a filter movement part configured to move the spatial filter part.

Optical inspection apparatus, a method of inspecting a substrate, and a method of treating a substrate

There is disclosed a graphics overlay device for overlaying a video signal and a graphics signal and outputting the overlayed signal, the graphics overlay device including a frame memory for storing video data, a video address generator for generating a video address which designates an area of the frame memory to read therefrom or store therein, at least two graphics overlay memories for reading and writing graphics data alternatively by a predetermined period wherein the writing is performed on an area designated by a graphics address and the reading is performed on an area designated by the video address, a multiplexer for selecting and outputting graphics data output from one of graphics overlay memories, a look up table for overlaying the video data output from the frame memory and the graphics data output from the multiplexer and outputting the overlayed data, and a central processing unit for generating the graphics data which designates an area of the graphics overlay memories on which the graphics data is to be stored, and a select controlling signal which controls recording and reading operations of the graphics overlay memories, and a switching operation of the multiplexer.

Graphics overlay device

An apparatus for measuring the degree of inclination of an objective lens for an optical pickup is provided. The apparatus for measuring the degree of inclination of the objective lens includes a light source, a collimator positioned between the light source and the objective lens, for collimating light emitted from the light source, a condensing lens for converging light passed through the collimator on the objective lens, a light receiving element for receiving light passed through the condensing lens after being reflected from the objective lens, and an optical path converting portion positioned along the optical path between the collimator and the condensing lens, for directing part of the light entering the optical path converting portion from the light source to travel toward the condensing lens and directing the remaining light toward the light receiving element, wherein a difference between the location of the light directly entering the light receiving element after being emitted from the optical path converting portion and the location of the light entering the light receiving element after being reflected from the objective lens is detected to measure the degree of inclination of the objective lens.

Growing community of inventors

Yongin-si, South Korea

Byeonghwan Jeon