Integrated Device Technology, Inc.

Bruce Schwegler

Kee W Park

Jeff Vesey

A packaged integrated circuit device and a circuit board assembly are disclosed that include a semiconductor die and a package substrate that includes a first grid array of contact pads that are electrically coupled to corresponding contact pads on the semiconductor die. The first grid array of contact pads includes a first set of adjacent rows or columns of contact pads that are coupled to a first channel that extends within a ground plane of the package substrate. The first grid array of contact pads includes a second set of adjacent rows or columns of contact pads that are electrically coupled to a second channel that extends within a power plane of the package substrate. The contact pads in the first set of adjacent rows or columns of contact pads directly overlie a portion of the first channel and the contact pads in the second set of adjacent rows or columns of contact pads directly overlie a portion of the second channel. A circuit board assembly is disclosed that includes a first grid array of contact pads disposed on a top side of a circuit board. The circuit board includes a first channel that extends within a ground plane of the circuit board and a second channel that extends within a power plane of the circuit board. The circuit board assembly can include decoupling capacitors disposed on the top side of the circuit board and the packaged integrated circuit device can include decoupling capacitors attached to the top of the package substrate.

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Morgan Hill, CA, United States of America

Bruce Schwegler