Synopsys, Inc.

Numerical Technologies, Inc.

Bruce Luttrell

A system is provided for fracturing a polygon on a mask layout used in a lithographic process for manufacturing an integrated circuit. The system receives mask layouts that include polygons that may include holes with exit routes near notches either on the outside of the polygon or internal to the hole. A notch is undesirable because fracturing the polygon for printing by the lithographic equipment can create slivers that do not expose well during exposure. The system moves the exit route for a vertex trace so that the exit route passes through a vertex of the notch thereby eliminating the sliver.

Fracturing polygons used in a lithography process for fabricating an integrated circuit

A system for fracturing polygons on masks used in lithography processes for manufacturing an integrated circuit is described. The system fractures polygons that include cavities in either the horizontal edges or the vertical edges by examining the aspect ratio (length/width) of prospective slices made at each vertex of the polygon. After determining the aspect ratio of each prospective slice, the system selects the slice with the lowest aspect ratio and slices the polygon into two sub-polygons. Slicing the polygon in this manner effectively eliminates 'slivers' or slices with extreme aspect ratios. This process is continued until each sub-polygon is either a rectangle or a trapezoid that can be printed by electron beam photolithography.

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San Jose, CA, United States of America

Bruce Luttrell