International Business Machines Corporation

Brian P Ronan

Steven H Voldman

Louis DeWolf Lanzerotti

A silicon germanium heterojunction bipolar transistor device and method comprises a semiconductor region, and a diffusion region in the semiconductor region, wherein the diffusion region is boron-doped, wherein the semiconductor region comprises a carbon dopant therein to minimize boron diffusion, and wherein a combination of an amount of the dopant, an amount of the boron, and a size of the semiconductor region are such that the diffusion region has a sheet resistance of less than approximately 4 Kohms/cm. Also, the diffusion region is boron-doped at a concentration of 1&#xd7;10/cmto 1&#xd7;10/cm. Additionally, the semiconductor region comprises 5&#x2013;25% germanium and 0&#x2013;3% carbon. By adding carbon to the semiconductor region, the device achieves an electrostatic discharge robustness, which further causes a tighter distribution of a power-to-failure of the device, and increases a critical thickness and reduces the thermal strain of the semiconductor region.

Silicon germanium heterojunction bipolar transistor with carbon incorporation

A silicon germanium heterojunction bipolar transistor device having a semiconductor region, and a diffusion region in the semiconductor region, wherein the diffusion region is boron-doped, wherein the semiconductor region comprises a carbon dopant therein to minimize boron diffusion, and wherein a combination of an amount of the dopant, an amount of the boron, and a size of the semiconductor region are such that the diffusion region has a sheet resistance of less than approximately 4 Kohms/cm . Also, the diffusion region is boron-doped at a concentration of 1&times;10 /cm to 1&times;10 /cm . Additionally, the semiconductor region comprises 5-25% germanium and 0-3% carbon. By adding carbon to the semiconductor region, the device achieves an electrostatic discharge robustness, which further causes a tighter distribution of a power-to-failure of the device, and increases a critical thickness and reduces the thermal strain of the semiconductor region.

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Brian P Ronan