Globalfoundries Inc.

Brian P Conchieri

Edward Crandal Cooney, Iii

Gary L Milo

Brett T Cucci

Patrick S Spinney

John C Hall

Thomas C Lee

Thomas W Weeks

Aspects of the present disclosure include a test structure that includes two or more devices. Each device includes a wire disposed within a dielectric and a first via disposed over the wire and in electrical contact with the wire. Each device includes a test pad electrically connected to the first via and a polysilicon resistor electrically connected to the wire. Each of the polysilicon resistors of the two or more devices are electrically tied together. A method for forming the interconnect structure to be used for testing is also provided.

Test structure for monitoring interface delamination

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Essex, VT, United States of America

Brian P Conchieri