Samsung Electronics Co., Ltd.

Bong-Soo Kang

Sooyong Lee

Dae-Hun Jung

Sangtae Kim

Kang-Min Jung

Kyoil Koo

Jung-Hwan Yeom

A method of fabricating a semiconductor device includes performing an optical proximity correction (OPC) operation on a design pattern of a layout, and forming a photoresist pattern on a substrate, using a photomask which is manufactured with the layout corrected by the OPC operation. The OPC operation includes generating a target pattern based on the design pattern, performing a first OPC operation, based on the target pattern, to generate a first correction pattern, measuring a target error by comparing a first simulation image of the first correction pattern with the target pattern, generating a retarget pattern from the target pattern, based on the target error, and performing a second OPC operation, based on the retarget pattern, to generate a second correction pattern.

Optical proximity correction method and method of fabricating a semiconductor device using the same

A method of fabricating a semiconductor device includes designing a layout, forming a photomask based on the layout, correcting an optical transmittance of the photomask, and performing a photolithography process using the photomask having the corrected optical transmittance to form a pattern on a substrate. The correcting the optical transmittance of the photomask includes creating an intensity map by capturing light that passes through the photomask, simulating the layout to create a virtual intensity map, and correcting an optical transmittance of a mask substrate of the photomask based on the intensity map and the virtual intensity map.

Method of fabricating a semiconductor device

An electronic device according to various embodiments is provided and includes a conductive inner module in which a plurality of layers are stacked; an electrical opening formed in at least a portion of the rim of the conductive inner module when stacking the plurality of layers; and an antenna module disposed at the periphery of the electrical opening, wherein the antenna module may include a feeding part formed on at least one of a plurality of layers forming the conductive inner module, and a conductive pattern which is connected to the feeding part and disposed circumferencing at least one of the electrical openings.

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Gyeonggi-do, South Korea

Bong-Soo Kang