Intel Corporation

Binh N Ngo

Raymond W Zeng

Bharat M Pathak

Rupinder K Bains

Pranav Kalavade

Rajesh Sundaram

Chang Wan Ha

Aliasgar S Madraswala

Zengtao T Liu

Sandeep K Guliani

Mase J Taub

Deepak Thimmegowda

Owen W Jungroth

Daniel R Elmhurst

Chuan Lin

Karthikeyan Ramamurthi

Naveen Prabhu Vittal Prabhu

Soo-yong Park

The total silicon area used by a plurality of high voltage transistors in an array of NAND cells is reduced by modifying the silicon area layout such that the size of the source and drain of each of the plurality of high voltage transistors is dependent on the maximum voltage to be applied to each of the source and drain for the respective one of the plurality of high voltage transistors.

Asymmetric junctions of high voltage transistor in NAND flash memory

A system for facilitating multiple concurrent page reads in a memory array is provided. Memory cells that have multiple programming states (e.g., store multiple bits per cell) rely on various control gate and wordline voltages levels to read the memory cells. Therefore, to concurrently read multiple pages of memory cells, where each page includes one or more different programming levels, a memory controller includes first wordline control logic that includes a first voltage regulator and includes second wordline control logic that includes a second voltage regulator, according to one embodiment. The two voltage regulators enable the memory controller to concurrently address and access multiple pages of memory at different programming levels, in response to memory read requests, according to one embodiment.

System and method for performing a concurrent multiple page read of a memory array

A method of providing multiple voltage outputs includes receiving an input signal from a multifunctional pump. The method also includes sending a first output signal based on the input signal using a first switch and sending a second output signal based on the input signal using a second switch and a transistor.

Circuit for providing multiple voltage signals

A circuit includes (i) an N-channel device having a gate, a source connected to low voltage, and a drain connected to a memory select gate, (ii) a P-channel device having a gate, a source, and a drain connected to the drain of the N-channel device, and (iii) a voltage supply connected to the source of the P-channel device, the voltage supply switching between a first high voltage and a first lower voltage. A gate driver supplies, to the gates of the N-channel and P-channel devices, a second high voltage, a second low voltage, or an intermediary voltage between the second high voltage and second low voltage. The gate driver supplies the intermediary voltage when the voltage supply switches between the first high voltage and first lower voltage.

Voltage driver for a memory

A regulator circuit to control the output of a charge pump circuit, to reduce the effects of operating temperature and process variations on available output current from the charge pump circuit. A predetermined fraction of the output voltage of the charge pump circuit is fed back to the input of a differential amplifier, which compares it to a reference voltage. The output of the differential amplifier feeds a voltage controlled oscillator (VCO), which in turn generates a clock signal that is used to drive the charge pump circuit. The normal temperature characteristics of this configuration cause the output of the charge pump circuit to degrade with temperature changes. The regulator circuit can be placed between the differential amplifier and the VCO to adjust the voltage driving the VCO. In one embodiment, a biasing resistor with a negative temperature coefficient can be used in the regulator circuit to offset the normal effects of temperature on the circuit. In another embodiment, multiple such resistors can be selectable with programmable logic, so that process variations during manufacture can be compensated for by selecting the resistor value that most closely provides optimal biasing.

Degenerative load temperature correction for charge pumps

A bias circuit for a memory cell having first and second floating gate devices, and third and fourth reference devices, one of which has an output terminal coupled thereto is described. In one embodiment, the bias circuit includes a first capacitor including a first terminal coupled to the gates of the first and second devices, and a second terminal coupled to a power supply terminal, and a second capacitor including a first terminal coupled to the gates of the third and fourth devices, and a second terminal coupled to the power supply terminal. The bias circuit further includes a reference circuit including a first terminal having a first signal thereon and coupled to the gates of the first and second devices, and a second terminal having a second signal thereon and coupled to the gates of the third and fourth devices, the reference circuit to periodically turn on the first and second signals. The bias circuit reduces standby current and wake up time of redundant circuits in non-volatile memory devices.

Method and apparatus for providing redundancy in non-volatile memory

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Folsom, CA, United States of America

Binh N Ngo