Growing community of inventors

Dresden, Germany

Berthold Reimer

Average Co-Inventor Count = 3.42

ph-index = 4

The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.

Forward Citations = 50

Berthold ReimerSven Beyer (5 patents)Berthold ReimerStephan Kronholz (3 patents)Berthold ReimerRichard Carter (3 patents)Berthold ReimerFalk Graetsch (3 patents)Berthold ReimerKlaus Hempel (2 patents)Berthold ReimerPatrick Press (2 patents)Berthold ReimerJohannes F Groschopf (2 patents)Berthold ReimerVivien Schroeder (2 patents)Berthold ReimerJohannes Von Kluge (2 patents)Berthold ReimerJoanna Wasyluk (2 patents)Berthold ReimerBoris Bayha (2 patents)Berthold ReimerPaul Raymond Besser (1 patent)Berthold ReimerMarkus Lenski (1 patent)Berthold ReimerJohn S Foster (1 patent)Berthold ReimerMartin Trentzsch (1 patent)Berthold ReimerRobert Binder (1 patent)Berthold ReimerRick J Carter (1 patent)Berthold ReimerArdechir Pakfar (1 patent)Berthold ReimerGregory Nowling (1 patent)Berthold ReimerBastian Haussdoerfer (1 patent)Berthold ReimerFernando Koch (1 patent)Berthold ReimerAndreas Hellmich (1 patent)Berthold ReimerGisela Schammler (1 patent)Berthold ReimerSven Metzger (1 patent)Berthold ReimerSimeon Morvan (1 patent)Berthold ReimerYew-Tuck Chow (1 patent)Berthold ReimerCarsten Metze (1 patent)Berthold ReimerKai Tern Sih (1 patent)Berthold ReimerClaudia Wolf (1 patent)Berthold ReimerBerthold Reimer (15 patents)Sven BeyerSven Beyer (83 patents)Stephan KronholzStephan Kronholz (69 patents)Richard CarterRichard Carter (27 patents)Falk GraetschFalk Graetsch (9 patents)Klaus HempelKlaus Hempel (22 patents)Patrick PressPatrick Press (14 patents)Johannes F GroschopfJohannes F Groschopf (8 patents)Vivien SchroederVivien Schroeder (7 patents)Johannes Von KlugeJohannes Von Kluge (7 patents)Joanna WasylukJoanna Wasyluk (6 patents)Boris BayhaBoris Bayha (5 patents)Paul Raymond BesserPaul Raymond Besser (212 patents)Markus LenskiMarkus Lenski (58 patents)John S FosterJohn S Foster (37 patents)Martin TrentzschMartin Trentzsch (26 patents)Robert BinderRobert Binder (12 patents)Rick J CarterRick J Carter (7 patents)Ardechir PakfarArdechir Pakfar (6 patents)Gregory NowlingGregory Nowling (5 patents)Bastian HaussdoerferBastian Haussdoerfer (4 patents)Fernando KochFernando Koch (4 patents)Andreas HellmichAndreas Hellmich (4 patents)Gisela SchammlerGisela Schammler (4 patents)Sven MetzgerSven Metzger (3 patents)Simeon MorvanSimeon Morvan (1 patent)Yew-Tuck ChowYew-Tuck Chow (1 patent)Carsten MetzeCarsten Metze (1 patent)Kai Tern SihKai Tern Sih (1 patent)Claudia WolfClaudia Wolf (1 patent)
..
Inventor’s number of patents
..
Strength of working relationships

Company Filing History:

1. Globalfoundries Inc. (15 from 5,671 patents)


15 patents:

1. 10559593 - Field-effect transistors with a grown silicon-germanium channel

2. 9842762 - Method of manufacturing a semiconductor wafer having an SOI configuration

3. 9054041 - Methods for etching dielectric materials in the fabrication of integrated circuits

4. 8951901 - Superior integrity of a high-K gate stack by forming a controlled undercut on the basis of a wet chemistry

5. 8815674 - Methods of forming a semiconductor device by performing a wet acid etching process while preventing or reducing loss of active area and/or isolation regions

6. 8716136 - Method of forming a semiconductor structure including a wet etch process for removing silicon nitride

7. 8703620 - Methods for PFET fabrication using APM solutions

8. 8658543 - Methods for pFET fabrication using APM solutions

9. 8580133 - Methods of controlling the etching of silicon nitride relative to silicon dioxide

10. 8524591 - Maintaining integrity of a high-K gate stack by passivation using an oxygen plasma

11. 8445344 - Uniform high-k metal gate stacks by adjusting threshold voltage for sophisticated transistors by diffusing a metal species prior to gate patterning

12. 8357575 - Technique for exposing a placeholder material in a replacement gate approach by modifying a removal rate of stressed dielectric overlayers

13. 8283232 - Enhanced etch stop capability during patterning of silicon nitride including layer stacks by providing a chemically formed oxide layer during semiconductor processing

14. 8247281 - Technique for exposing a placeholder material in a replacement gate approach by modifying a removal rate of stressed dielectric overlayers

15. 8048748 - Reducing contamination in a process flow of forming a channel semiconductor alloy in a semiconductor device

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