Leybold Aktiengesellschaft

Singulus Technologies Ag

Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.v.

Berthold Ocker

Mark Saunders

Wolfram Maass

Reiner Hinterschuster

Roland Gesche

Markus Pfeffer

Jürgen Langer

Oliver Hohn

Wolfram MAAß

Dietmer Schneider

Roland Schneider

Helmut John

Rudi Spielvogel

Reinhard Sommerfeld

Christoph Mundorf

Eric Claussen

Wolfgang Stern

Helmut Lausmann

Uwe Mühlfeld

Matthias Landmann

Ulrich Schöpka

Richard ÖChsner

Dietmar Schneider

The disclosure relates to a method of determining a velocity profile for the movement of a substrate to be coated relative to a coating source.

Method of coating substrates

A system and method for treating a substrate in a reaction chamber. A transfer chamber is arranged between a first lock and a second lock, wherein the second lock is provided between the transfer chamber and the reaction chamber. A substrate is transferred into the transfer chamber through the first lock, and the first lock is closed. In a next step, the transfer chamber is flooded with the same gas as in the reaction chamber and the pressure and temperature of the gaseous atmosphere in the transfer chamber is controlled to be the same as in the reaction chamber. Then, the second lock is opened and the substrate is transferred from the transfer chamber into the reaction chamber to treat the substrate. A computer program product for carrying out the above method.

Method and system for naturally oxidizing a substrate

The invention relates to a target for coating a substrate with an alloy by means of cathode sputtering, said alloy having at least one first material and one second material as alloy components. The surface of the target has at least one first section made of the first material and one second section made of the second material. The two sections adjoin each other and form a common boundary line. The invention further relates to a device and a method for coating a substrate with an alloy by means of cathode sputtering using the target according to the invention.

Coating substrates with an alloy by means of cathode sputtering

The invention relates to a sputtering cathode () for coating a substrate (), which comprises a device () for generating an external magnetic field with substantially parallel magnetic field lines () substantially in the plane of the substrate. The invention further relates to a device and a method for coating a substrate with several layers, whereby several sputtering cathodes are disposed in a circle with their target effective areas pointing radially outward.

Sputtering cathode and device and method for coating a substrate with several layers

An evacuable chamber serving as a cathode contains a rotatable magnet system and is connected to a high frequency power supply for sputtering a target. The chamber is electrically isolated from an evacuable housing containing the substrate to be coated, the chamber being covered by a cup-like shield fixed to the housing to define an interior space. A pipe for evacuating the chamber includes first and second sections separated by a gap and connected by an electrically insulating collar in which parallel metal grids are installed in the gap and respectively connected to the power source and to ground in order to prevent the formation of secondary plasma.

Cathodic sputtering system

Individual target segments (A-F), are mounted on a mounting plate by means of locating studs inserted into mounting holes of elongate or circular cross sections in correspondence with the change in length caused by the thermal expansion of the target segments. The segments are retained by screws received in tapped bones in the studs, which are welded to the target backplates. The individual segments (A-F) each consist of a target backplate and a target bonded to the backplate. The perimeter of each backplate over laps the perimeter of each target segment, this overlap amounting to 0.05-0.2 mm when molybdenum or titanium is used for the target backplate and an indium-tin alloy is used for the sputter target.

Large area sputter cathode having floating target segments

The target (5) of a sputter cathode 3 is permanently bonded to a metallic backing plate (14, 15) with a coefficient of thermal expansion similar to that of the target (5). This backing plate (14, 15) is held removably on the electrode (4), for example by means of spring clips (16, 17).

Sputter cathode

The inside of a coating chamber (2) has a sputtering cathode (3) bearing a magnet set (6) and having a pot-shaped electrode (4) and a target (5). The electrode (4) is closed on the side facing away from the target (5) by a cover (11) to form a pressure equalizing chamber (12). The latter has a vacuum connection (13) for establishing a vacuum acting against the vacuum in the coating chamber (2).

Coating apparatus

Growing community of inventors

Hanau, Germany

Berthold Ocker