Carl Zeiss Smt Gmbh

Carl-zeiss-smt Ag

Asml Netherlands B.v.

Carl-zeiss-stiftung

Carl Zeiss Semiconductor Manufacturing Technologies Ag

Bernhard Gellrich

Jens Kugler

Hubert Holderer

Bernhard Geuppert

Stefan Xalter

Andreas Wurmbrand

Stefan Hembacher

Thomas Petasch

Ulrich Weber

Armin Schoeppach

Alexander Kohl

Franz Sorg

Frank Melzer

Erik Roelof Loopstra

Christiaan Alexander Hoogendam

Bob Streefkerk

Guido Limbach

Thomas Ittner

Johannes Rau

Gerhard Fuerter

Martin Mahlmann

Wolfgang Singer

Yim-Bun Patrick Kwan

Martin Antoni

Ulrich Loering

Dirk Schaffer

Julian Kaller

Michael Muehlbeyer

Wilhelm Egle

Jochen Becker

Klaus Guenther Beck

Peter Deufel

Payam Tayebati

Viktor Kulitzki

Karl-Heinz Schimitzek

Cornelia Roesch

Hans-Juergen Scherle

Wilhelm Ulrich

Johannes Wangler

Sascha Bleidistel

Aksel Goehnermeier

Markus Weiss

Juergen Fischer

Bauke Jansen

Dirk Hellweg

Thomas Bischoff

Ulrich Bingel

Michael Trunz

Jens Prochnau

Joachim Hainz

Joachim Wietzorrek

Erich Schubert

Tilman Schwertner

Hartmut Muenker

Sascha Kraus

Werner Lang

Johannes Jacobus Matheus Baselmans

Toralf Gruner

Aurelian Dodoc

Rolf Freimann

Daniel Kraehmer

Boris Bittner

Tjarko Adriaan Rudolf Van Empel

Hans-Juergen Rostalski

Susanne Beder

Johannes Lippert

Matthias Manger

Christoph Zaczek

Yuri Johannes Gabriël Van De Vijver

Paul Graeupner

Sonja Schneider

Thomas Schletterer

Hermann Bieg

Marwène Nefzi

Martin Weiser

Uy-Liem Nguyen

Stephan Six

Willi Heintel

Antonius Johannes Van Der Net

Axel Lorenz

Ralf Zweering

Olaf Rogalsky

Andreas Seifert

Michael Erath

Karl Heinz Schuster

Andreas Frommeyer

Yim-Bun-Patrick Kwan

Harald Kirchner

Joerg Mallmann

Jens Ullmann

Guenter Maul

Michael Mühlbeyer

Dieter Schmerek

Albrecht Ranck

Michael Widmann

Stefan Schaff

Christian Zengerling

Ralf Hilgers

Michael Lill

Martin Humphries

A projection exposure apparatus for semiconductor lithography having a projection optical unit. The projection optical unit includes a sensor frame, a carrying frame, and a module. The module includes an optical element and actuators for positioning and orienting the optical element. The module is on the carrying frame, and the sensor frame is a reference for the positioning of the optical element. The module includes an infrastructure which includes interfaces for separating a module from the projection optical unit. A method exchanges the module of a projection optical unit of a projection exposure apparatus for semiconductor lithography, wherein the module includes an optical element, while the reference remains in the projection exposure apparatus.

Projection exposure apparatus for semiconductor lithography

An optical arrangement, in particular a lithography system, includes: a movable component, in particular a mirror; at least one actuator for moving the component; and at least one stop having a stop face for delimiting the movement of the component. The optical arrangement further includes, on a stop or on a plurality of stops, at least two stop faces for delimiting the movement of the movable component in one and the same movement direction.

Optical arrangement, in particular lithography system

An imaging optical system, in particular a projection objective, for microlithography, includes optical elements to guide electromagnetic radiation with a wavelength in a path to image an object field into an image plane. The imaging optical system includes a pupil, having coordinates (p, q), which, together with the image field, having coordinates (x, y) of the optical system, spans an extended 4-dimensional pupil space, having coordinates (x, y, p, q), as a function of which a wavefront W(x, y, p, q) of the radiation passing through the optical system is defined. The wavefront W can therefore be defined in the pupil plane as a function of an extended 4-dimensional pupil space spanned by the image field (x, y) and the pupil (p, q) as W(x, y, p, q)=W(t), with t=(x, y, p, q).

Imaging optical system for microlithography

A connection arrangement is provided for a force-fit connecting ceramic components for a lithography apparatus. The connection arrangement includes first and a second ceramic components and a clamping device. The clamping device directly clamps the first and the second ceramic component against one another in a force-fit manner.

Connection arrangement for a force-fit connection between ceramic components

An optical element unit including a first optical element module and a sealing arrangement is disclosed. The first optical element module occupies a first module space and includes a first module component of a first component type and an associated second module component of a second component type. The first component type is optical elements and the second component type being different from the first component type. The sealing arrangement separates the first module space into a first space and a second space and substantially prevents, at least in a first direction, the intrusion of substances from one of the first space and the second space into the other one of the first space and the second space. The first module component at least partially contacts the first space and, at least in its area optically used, not contacting the second space. The second module component at least partially contacts the second space.

Optical element unit for exposure processes

The disclosure relates to a mirror module, in particular for a microlithographic projection exposure apparatus, including a mirror, which has a mirror body and an optically effective surface. The mirror body has a first material, and a supporting structure for connecting the mirror body to an objective structure. The supporting structure has a second material. The first material and the second material differ in terms of their coefficients of thermal expansion by less than 0.5*10Kin a temperature range around an operating temperature which is reached by the mirror module during operation in the region of the connection of the mirror body to the supporting structure.

Mirror module, in particular for a microlithographic projection exposure appararatus

An optical projection unit includes first and second optical element modules. The first optical element module includes a first housing unit and a first optical element received within the first housing unit and having an optically used first region defining a first optical axis. The second optical element module is located adjacent to the first optical element module and includes a second optical element which defines a second optical axis of the optical projection unit. The first housing unit has a central first housing axis and an outer wall extending in a circumferential direction about the first housing axis. The first optical axis is laterally offset and/or inclined with respect to the first housing axis. The first housing axis is substantially collinear with the second optical axis.

Optical projection system

There is provided an optical imaging device, in particular for microlithography, comprising at least one optical element and at least one holding device associated to the optical element (), wherein the holding device holds the optical element and a first part () of the optical element contacts a first atmosphere and a second part () of the optical element at least temporarily contacts a second atmosphere. There is provided a reduction device at least reducing dynamic fluctuations in the pressure difference between the first atmosphere and the second atmosphere.

Optical imaging device and method for reducing dynamic fluctuations in pressure difference

An optical imaging device, in particular for use in microlithography, includes a mask device for receiving a mask having a projection pattern, a projection device with an optical element group, a substrate device for receiving a substrate and an immersion zone. The optical element group is adapted to project the projection pattern onto the substrate and includes a plurality of optical elements with an immersion element to which the substrate is at least temporarily located adjacent to during operation. During operation, the immersion zone is located between the immersion element and the substrate and is at least temporarily filled with an immersion medium. A thermal attenuation device is provided, the thermal attenuation device being adapted to reduce fluctuations within the temperature distribution of the immersion element induced by the immersion medium.

Optical imaging device with thermal attenuation

An optical arrangement includes a multiplicity of optical elements and a carrier structure which carries the optical elements. The carrier structure is composed of at least two releasably interconnected modules. Each module is composed of at least one carrier structure subelement. A subhousing is produced by a multiplicity of carrier structure subelements and/or modules. The subhousing has a geometry that varies, at least in regions, in correspondence to a usable beam path in the projection exposure apparatus, the usable beam path being defined as an envelope of all light bundles which can propagate from all field points in a field plane to an image plane of the projection exposure apparatus. A projection exposure apparatus for EUV lithography includes such an optical arrangement.

Optical arrangement in a projection exposure apparatus for EUV lithography

Liquid is supplied to a space between the projection system of a lithographic apparatus and a substrate. A flow of gas towards a vacuum inlet prevents the humid gas from escaping to other parts of the lithographic apparatus. This may help to protect intricate parts of the lithographic apparatus from being damaged by the presence of humid gas.

Lithographic apparatus and device manufacturing method

An optical projection system for a microlithography system includes a light path, a first lens unit receiving a first part of the light path, a second lens unit receiving a second part of the light path, and a support unit supporting the first and second lens units. The first and second lens units are elongated lens units including a plurality of lenses. The support unit includes a housing receiving a third part of the light path and enclosing a reflective element. The housing includes first and second interfaces. The first interface is a first support interface supporting the first lens unit. The second interface is a second support interface supporting the second lens unit at a location substantially opposite to the first interface.

An optical element unit includes a first optical element module and a sealing arrangement. The first optical element module occupies a first module space and includes a first module component of a first component type and an associated second module component of a second component type. The first component type is optical elements and the second component type being different from the first component type. The sealing arrangement separates the first module space into a first space and a second space and substantially pre-vents, at least in a first direction, the intrusion of substances from one of the first space and the second space into the other one of the first space and the second space. The first module component at least partially contacts the first space and, at least in its area optically used, not contacting the second space. The second module component at least partially contacts the second space.

Optical element unit for exposure processes having sealing element

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Aalen, Germany

Bernhard Gellrich