Hoechst Celanese Corporation

Hoechst Aktiengesellschaft

Bernd Hupfer

Dinesh N Khanna

Werner H Mueller

Gerhard Buhr

Charlotte Eckes

This invention is that of high temperature polyamides containing the hexafluoroisopropylidene group. The high temperature polyamides of the invention and photo or radiation sensitizers provide improved high temperature positive resists which can be developed in aqueous alkaline developer and thermally anneal to form heat resistant, polyoxazole relief structures suitable for use in microelectronic and printing applications. The positive photoresists of the invention have improved solubility in coating solvents and improved photospeed. The polyamides of the invention can be prepared by conventional condensation reactions; e.g. the condensation of a diamine and diacid chloride. In addition the polyamides of this invention provide high temperature protective coatings with superior adhesion properties in applications other than the photoresist area.

Polyamide containing the hexafluoroisopropylidene group and process of

A photopolymerizable mixture for producing relief structures composed of highly heat-resistant polymers is described which is composed essentially of a soluble prepolymer containing photosensitive radicals bound in an ester-like manner to carboxyl groups, monomers and a photoinitiator, wherein the photoinitiator carries at least one trihalomethyl group which reacts when exposed to light. Of advantage is the fact that, even after exposure times which are by a factor of 4 to 5 shorter compared with conventional photopolymerizable mixtures, sharp-edged resist images can be obtained with a resolution of less than 3 .mu.m.

Photopolymerizable mixture, copying material containing same and process

Polyamide containing the hexafluoroisopropylidene group

Polyamide containing the hexafluoroisopropylidene group with O-quinone

Described are polyamic acids, at least 50 mole-% of which are comprised of recurrent units corresponding to the general formula I: ##STR1## wherein, R.sup.1 is a mono-, di-, tri- or tetranuclear aromatic group and

Polyamic acids, polyimides prepared from these and process for producing

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North Kingstown, RI, United States of America

Bernd Hupfer