Micron Technology Incorporated

Intel Corporation

Applied Materials, Inc.

Barbara L Casey

John David Hopkins

David A Daycock

Qian Tao

Christopher J Larsen

Justin B Dorhout

Richard J Hill

Brett D Lowe

Woohee Kim

David J Keller

Madison E Wale

Purnima Narayanan

Meng-Wei Kuo

Guoxing Duan

Sri Divya Deenadayalan

Surabhi Anurag

Methods, devices, and systems associated with identifying data to transform are described. A method can include receiving, at a model stored on a computing device, data comprising a number of images, receiving, at the model, an input from a user, identifying, via the model, a number of attributes based on the input from the user, and identifying, via the model, a portion of an image of the number of images including at least one of the number of attributes to transform.

Identifying data in a number of images to transform with identification of a blank and colored portions

A 3D NAND storage device includes a plurality of layers containing doped semiconductor material interleaved with a plurality of layers of dielectric material. Each of the pillars forming the 3D NAND storage device includes a plurality of memory cells and a drain-end select gate (SGD). The pillars are separated by a hollow channel in which a plurality of film layers, including at least a lower film layer and an upper film layer have been deposited. The systems and methods described herein remove at least the upper film layer proximate the SGD while maintaining the film layers proximate the memory cells. Such an arrangement beneficially permits tailoring the film layers proximate the SGD prior to depositing the channel film layer in the hollow channel. The systems and methods described herein permit the deposition of a continuous channel film layer proximate both the memory cells and the SGD.

3D NAND with integral drain-end select gate (SGD)

Some embodiments include a memory array which has a vertical stack of alternating insulative levels and wordline levels. The wordline levels have terminal ends corresponding to control gate regions. Charge-trapping material is along the control gate regions of the wordline levels and not along the insulative levels. The charge-trapping material is spaced from the control gate regions by charge-blocking material. Channel material extends vertically along the stack and is laterally spaced from the charge-trapping material by dielectric material. Some embodiments include methods of forming NAND memory arrays.

Memory arrays, and methods of forming memory arrays

A plasma-enhanced method of selectively etching silicon dielectrics, such as silicon nitride, silicon oxide, silicon oxynitride, or silicon oxime relative to photoresist in a single step. A combination of a fluorocarbon selectivity agent such as difluoromethane, and a fluorocarbon etchant gas such as carbon tetrafluoride or pentafluoroethane, is used as the source gas for the plasma etch. The source gas concentration is within the range of approximately 1:2 to 2:1 selectivity agent to etchant gas, and the resultant plasma etches silicon dielectric at a rate approximately four times as fast as photoresist. The process is particularly useful for the etching of silicon dielectric spacers, or silicon nitride layers in the initial stages of a LOCOS process.

Highly selective dry etching process

Growing community of inventors

Meridian, ID, United States of America

Barbara L Casey