Growing community of inventors

Boise, ID, United States of America

Baosuo Zhou

Average Co-Inventor Count = 3.16

ph-index = 11

The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.

Forward Citations = 925

Baosuo ZhouArdavan Niroomand (16 patents)Baosuo ZhouMirzafer K Abatchev (15 patents)Baosuo ZhouPaul A Morgan (8 patents)Baosuo ZhouBrian J Coppa (8 patents)Baosuo ZhouJoseph Neil Greeley (7 patents)Baosuo ZhouShuang Meng (6 patents)Baosuo ZhouKrupakar Murali Subramanian (6 patents)Baosuo ZhouDavid H Wells (5 patents)Baosuo ZhouRamakanth Alapati (5 patents)Baosuo ZhouMeihua Shen (4 patents)Baosuo ZhouJohn Hoang (4 patents)Baosuo ZhouGurtej S Sandhu (3 patents)Baosuo ZhouThorsten B Lill (3 patents)Baosuo ZhouVishal Sipani (3 patents)Baosuo ZhouMing-Chuan Yang (3 patents)Baosuo ZhouFatma Arzum Simsek-Ege (2 patents)Baosuo ZhouFarrell Martin Good (2 patents)Baosuo ZhouXiaolong Fang (2 patents)Baosuo ZhouJialing Yang (2 patents)Baosuo ZhouShuang Meng (2 patents)Baosuo ZhouHarmeet Singh (1 patent)Baosuo ZhouAlex J Schrinsky (1 patent)Baosuo ZhouJi Zhu (1 patent)Baosuo ZhouYoshie Kimura (1 patent)Baosuo ZhouGowri Kamarthy (1 patent)Baosuo ZhouMonica Titus (1 patent)Baosuo ZhouYifeng Zhou (1 patent)Baosuo ZhouShuogang Huang (1 patent)Baosuo ZhouPrithu Sharma (1 patent)Baosuo ZhouJoseph Neil Greely (1 patent)Baosuo ZhouKrupaker Murali Subramanian (1 patent)Baosuo ZhouRamakanth Alapati (0 patent)Baosuo ZhouArdavan Niroomand (0 patent)Baosuo ZhouBaosuo Zhou (36 patents)Ardavan NiroomandArdavan Niroomand (45 patents)Mirzafer K AbatchevMirzafer K Abatchev (56 patents)Paul A MorganPaul A Morgan (54 patents)Brian J CoppaBrian J Coppa (13 patents)Joseph Neil GreeleyJoseph Neil Greeley (34 patents)Shuang MengShuang Meng (37 patents)Krupakar Murali SubramanianKrupakar Murali Subramanian (20 patents)David H WellsDavid H Wells (156 patents)Ramakanth AlapatiRamakanth Alapati (21 patents)Meihua ShenMeihua Shen (43 patents)John HoangJohn Hoang (10 patents)Gurtej S SandhuGurtej S Sandhu (1,435 patents)Thorsten B LillThorsten B Lill (106 patents)Vishal SipaniVishal Sipani (24 patents)Ming-Chuan YangMing-Chuan Yang (18 patents)Fatma Arzum Simsek-EgeFatma Arzum Simsek-Ege (134 patents)Farrell Martin GoodFarrell Martin Good (32 patents)Xiaolong FangXiaolong Fang (8 patents)Jialing YangJialing Yang (7 patents)Shuang MengShuang Meng (2 patents)Harmeet SinghHarmeet Singh (88 patents)Alex J SchrinskyAlex J Schrinsky (30 patents)Ji ZhuJi Zhu (25 patents)Yoshie KimuraYoshie Kimura (17 patents)Gowri KamarthyGowri Kamarthy (16 patents)Monica TitusMonica Titus (15 patents)Yifeng ZhouYifeng Zhou (12 patents)Shuogang HuangShuogang Huang (6 patents)Prithu SharmaPrithu Sharma (5 patents)Joseph Neil GreelyJoseph Neil Greely (1 patent)Krupaker Murali SubramanianKrupaker Murali Subramanian (1 patent)Ramakanth AlapatiRamakanth Alapati (0 patent)Ardavan NiroomandArdavan Niroomand (0 patent)
..
Inventor’s number of patents
..
Strength of working relationships

Company Filing History:

1. Micron Technology Incorporated (30 from 37,972 patents)

2. Lam Research Corporation (4 from 3,777 patents)


36 patents:

1. 12463044 - Pitch reduction technology using alternating spacer depositions during the formation of a semiconductor device and systems including same

2. 11935756 - Pitch reduction technology using alternating spacer depositions during the formation of a semiconductor device and systems including same

3. 11335563 - Pitch reduction technology using alternating spacer depositions during the formation of a semiconductor device and systems including same

4. 10784086 - Cobalt etch back

5. 10607844 - Pitch reduction technology using alternating spacer depositions during the formation of a semiconductor device and systems including same

6. 10096483 - Pitch reduction technology using alternating spacer depositions during the formation of a semiconductor device and systems including same

7. 9870899 - Cobalt etch back

8. 9761457 - Pitch reduction technology using alternating spacer depositions during the formation of a semiconductor device and systems including same

9. 9679781 - Methods for integrated circuit fabrication with protective coating for planarization

10. 9589853 - Method of planarizing an upper surface of a semiconductor substrate in a plasma etch chamber

11. 9570320 - Method to etch copper barrier film

12. 9330934 - Methods of forming patterns on substrates

13. 9305782 - Pitch reduction technology using alternating spacer depositions during the formation of a semiconductor device and systems including same

14. 9184159 - Simplified pitch doubling process flow

15. 9003651 - Methods for integrated circuit fabrication with protective coating for planarization

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12/25/2025
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