Applied Materials, Inc.

Babu Chinnasamy

Paul Benjamin Reuter

Dean C Hruzek

Douglas Brian Baumgarten

Devendra Channappa Holeyannavar

Srinivas Poshatrahalli Gopalakrishna

Lakshmikantha K Shirahatti

Electronic device manufacturing systems may include an equipment front end module (EFEM) having a load port assembly configured to receiving a substrate carrier, which may be a front opening unified pod (FOUP). The load port assembly may have a receiving plate upon which the substrate carrier may be received. The receiving plate may have a plurality of gas nozzles that can be coupled to purge ports in a bottom of the substrate carrier and to a purge apparatus of the load port assembly. The purge apparatus is configured to provide a gas to the substrate carrier at a selectable gas flow rate and, in some embodiments, to provide a gas to different portions of the substrate carrier each at a selectable gas flow rate. Methods of providing selectable gas flow rates for purging a substrate carrier coupled to a load port assembly are also provided, as are other aspects.

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Bengaluru, India

Babu Chinnasamy