Kla Tencor Corporation

Kla-tencor Technologies Corporation

Avijit K Ray-Chaudhuri

Mehdi Vaez-Iravani

Guoheng Zhao

Andrew V Hill

Lisheng Gao

Kenong Wu

Raghav Babulnath

Systems and methods for classifying defects detected on a wafer are provided. One method includes detecting defects on a wafer based on output generated for the wafer by an inspection system. The method also includes determining one or more attributes for at least one of the defects based on portions of a standard reference image corresponding to the at least one of the defects. The method further includes classifying the at least one of the defects based at least in part on the one or more determined attributes.

Defect detection and classification based on attributes determined from a standard reference image

Fourier filters and wafer inspection systems are provided. One embodiment relates to a one-dimensional Fourier filter configured to be included in a bright field inspection system such that the bright field inspection system can be used for broadband dark field inspection of a wafer. The Fourier filter includes an asymmetric illumination aperture configured to be positioned in an illumination path of the inspection system. The Fourier filter also includes an asymmetric imaging aperture complementary to the illumination aperture. The imaging aperture is configured to be positioned in a light collection path of the inspection system such that the imaging aperture blocks light reflected and diffracted from structures on the wafer and allows light scattered from defects on the wafer to pass through the imaging aperture.

Fourier filters and wafer inspection systems

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San Ramon, CA, United States of America

Avijit K Ray-Chaudhuri