Adv Antest Corporation

Atsuyuki Doi

Takashi Naitou

Yoshimasa Ito

Providing a test head capable of suppressing a probe card from bending. The test headcomprises: a test head main bodyhaving a frame; an interface apparatuselectrically connecting a probe cardand the test head main bodywith each other; and a brake unitpositioned between the probe cardand the frameto transmit a pressing force F applied to the probe cardto the frame

Test head and semiconductor wafer test apparatus comprising same

An apparatus comprises: an engagement shaft able to engage with a bottom surface of a DSA and held linear movably; an air cylinder supplying a drive force for linearly moving the engagement shaft; and a link mechanism interposed between the air cylinder and the engagement shaft and transmitting the drive force input from the actuator to the engagement shaft, and the link mechanism transmits the drive force input from the air cylinder by rotary motion.

Attachment apparatus, test head, and electronic device test system

A burn-in apparatus for conducting a burn-in test by housing a burn-in board mounted with a large number of DUT in a burn-in chamber, moving a temperature adjustment board downward and bringing temperature adjustment arrays attached to the temperature adjustment board contact with corresponding DUT; comprising a push-pull device having a movable body moving back and forth in the horizontal direction of a board surface of the burn-in board and a cam mechanism composed of a tilted cam and cam follower for elevating/lowering an elevator board by converting a back-and-forth movement of the movable body to a vertical movement is provided; wherein the push-pull device for elevating/lowering the temperature adjustment board can be downsized, so that a more compact burn-in apparatus can be provided.

Growing community of inventors

Tokyo, Japan

Atsuyuki Doi