Ebara Corporation

Atsushi Chono

Kenichi Suzuki

Akihisa Hongo

Satoshi Sendai

Naoaki Ogure

Fumio Kuriyama

Hiroyuki Ueyama

Junitsu Yamakawa

Koji Mishima

Norio Kimura

Hiroaki Inoue

Manabu Tsujimura

Mizuki Nagai

Junichiro Yoshioka

Mitsuo Tada

Akira Ogata

Kenya Tomioka

Naomitsu Ozawa

Yoshitaka Mukaiyama

The plating apparatus has a plating section in which a plating process is performed and a control section for regulating the plating solution. The plating section includes a plating bath containing plating solution, an anode provided in the plating solution, and a plating object serving as a cathode placed in the plating solution opposite the anode. The control section includes a regulating tank for regulating the composition and/or concentration of the plating solution, and a replenishing tank for injecting solution into the plating solution in the regulating tank. The plating apparatus also includes a mechanism for circulating plating solution between the regulating tank in the control section and the plating bath in the plating section. The plating section is installed in a first room, while the control section is installed in a second room, which is separate from the first room Accordingly, contamination in the plating section is prevented.

Plating apparatus

A substrate plating apparatus forms an interconnection layer on an interconnection region composed of a fine groove and/or a fine hole defined in a substrate. The substrate plating apparatus includes a plating unit for forming a plated layer on a surface of the substrate including the interconnection region, a chemical mechanical polishing unit for chemically mechanically polishing the substrate to remove the plated layer from the surface of the substrate leaving a portion of the plated layer in the interconnection region, a cleaning unit for cleaning the substrate after the plated layer is formed or the substrate is chemically mechanically polished, a drying unit for drying the substrate after the substrate is cleaned, and a substrate transfer unit for transferring the substrate to and from each of the first plating unit, the first chemical mechanical polishing unit, the cleaning unit, and the drying unit. The first plating unit, the first chemical mechanical polishing unit, the cleaning unit, the drying unit, and the substrate transfer unit are combined into a unitary arrangement.

Substrate plating apparatus

The present invention relates to a substrate plating apparatus for plating a substrate in a plating bath containing plating solution. An insoluble anode is disposed in the plating bath opposite the substrate. The substrate plating apparatus comprises a circulating vessel or dummy vessel provided separate from the plating bath, with a soluble anode and a cathode disposed in the circulating vessel or dummy vessel. An anion exchange film or selective cation exchange film is disposed between the anode and cathode and isolates the same, wherein metal ions are generated in the circulating vessel or dummy vessel by flowing current between the soluble anode and the cathode therein, and the generated metal ions are supplied to the plating bath. The substrate plating apparatus can also comprise an ion exchange film or neutral porous diaphragm disposed between the substrate and anode in the plating bath, wherein the ion exchange film or neutral porous diaphragm divides the plating bath into a substrate region and an anode region.

Substrate plating apparatus and method

An object of the present invention is to provide a substrate plating apparatus capable of performing continuous plating operations within one apparatus without the wafers becoming contaminated after the post-plating process by chemicals used in the plating process and the like. Further object is to provide a substrate plating apparatus capable of forming a plating film of uniform thickness on the plating surface of the wafer, while encouraging bubbles to escape from fine holes or grooves in the substrate surface and deterring particles from depositing on the plated surface. According to the present invention, there is provided a substrate plating apparatus for continuously performing a plating process and post-plating process within the same apparatus, the substrate plating apparatus comprising a contaminated zone within which the plating process is performed; a clean zone within which the post-plating process is performed; and a partition dividing the apparatus into the contaminated zone and the clean zone, wherein each zone is independently ventilated. A substrate plating apparatus for plating a surface of a substrate with a plating solution comprises a plating bath that is hermetically sealed and accommodates the substrate to be plated; and a flow path of the plating solution being formed to be parallel to the surface of the substrate.

The present invention is to provide a conduction detection device that can detect electrical conductivity (contact condition) of feeding contacts with conductive layers of a substrate. The present invention also provides an electroplating apparatus, which is able to produce uniform currents to flow through each of feeding contacts. The apparatus has a plating vessel, in which an electrode is disposed opposite to a substrate which is affixed to a plating jig electrically through a plurality of feeding contacts for applying a specific voltage between the electrode and conductive layers provided on a plating surface of the substrate. Plating current flows from the plating jig through the feeding contacts to the substrate. A conduction detection device is provided to detect electrical conductive states between the plurality of feeding contacts and the conductive layer on the substrate.

Plating device

The present invention provides a conductivity sensing device capable of detecting the conductivity (contact state) of the plurality of feeder contacts contacting the conductive area of the substrate, and a plating apparatus capable of forming a plating film of uniform thickness by supplying a uniform plating current through a plurality of feeder contacts.

Plating apparatus for detecting the conductivity between plating contacts on a substrate

Substrate plating device

The present invention is to provide a wafer plating jig for a plating apparatus having a simple construction and capable of sealing conducting pins from the plating solution completely. The wafer plating jig for gripping a wafer, comprises a main jig body ( ) having a plurality of gripping mechanisms ( ) and a plurality of conducting pins disposed thereon. A seal packing ( ) is provided to surround each of the conducting pins. When the wafer is gripped by the gripping mechanisms ( ), each end of the conducting pins individually contacts conductive film formed on the wafer and being sealed by the seal packing ( ).

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Tokyo, Japan

Atsushi Chono