Tokyo Electron Limited

Ckd Corporation

Atsuhiko Tabuchi

Takahiro Minatani

Keiichi Nishikawa

Yasuhisa Hirose

Kazutoshi Itoh

Hideki Wakai

Atsushi Kobayashi

A temperature control system includes a first temperature adjustment unit storing fluid at a first temperature; a second temperature adjustment unit storing fluid at a second temperature higher than the first temperature; a low-temperature flow path for passing fluid supplied from the first temperature adjustment unit; a high-temperature flow path for passing fluid supplied from the second temperature adjustment unit; a bypass flow path for circulating fluid; a combination flow path for passing fluid from the low-temperature flow path, the high-temperature flow path, and the bypass flow path merged at a merging part; a temperature adjustment part that passes fluid from the combination flow path and cools/heats a member of a semiconductor manufacturing device; and a control device that controls valve positions of variable valves attached to the three flow paths upstream of the merging part and adjusts the flow rate distribution ratio for the three flow paths.

Temperature control system, semiconductor manufacturing device, and temperature control method

A temperature control systemincludes a joint paththat supplies a fluid from a low-temperature pathhaving a variable valveand a high-temperature pathhaving a variable valveto a temperature regulation member; a bypass paththat has a variable valveand circulates the fluid flowing a collection paththat collects the supplied fluid through the temperature regulation member; a circulation pumpat the collection path; and a tankthat is provided at an upstream side of the circulation pump and supplies the fluid to the circulation pump when an amount of the fluid reaches a preset amount. The variable valvesandare opened to supply the fluid, and the valvesandare opened to supply the fluid after detecting that the amount of the fluid in the tankreaches the preset amount.

Method of supplying temperature control fluid to temperature control system and storage medium

In a control method, a first processing is performed on an object to be processed by controlling a temperature of a base to a first temperature and controlling a temperature of an electrostatic chuck that is disposed on a mounting surface of the base so as to mount thereon the object to be processed and has a heater installed therein to a second temperature. A second processing is performed on the object by controlling a temperature of the base to a third temperature and controlling a temperature of the electrostatic chuck to a fourth temperature by a heater. In the control method, a difference between the first temperature and the second temperature and a difference between the third temperature and the fourth temperature are within a tolerable temperature of the junction layer for bonding the base and the electrostatic chuck.

Plasma etching apparatus and control method

Growing community of inventors

Miyagi, Japan

Atsuhiko Tabuchi