Hitachi Chemical Company, Ltd.

Hitachi, Ltd.

Asao Isobe

Shigeru Koibuchi

Nobuyuki Hayashi

Katsushige Tsukada

Daisuke Makino

Toshiaki Ishimaru

Masahiro Abo

Hiroshi Shiraishi

Michiaki Hashimoto

Shigeyoshi Tanaka

Ken Ogawa

Hitoshi Yokono

Fumio Murai

Takumi Ueno

Fusaji Shoji

Fumio Kataoka

Takao Hirayama

Kengo Kobayashi

Yutaka Takeda

Hideo Yamada

Ryoji Ukita

Eiichi Ohtani

Hajime Hayakawa

Tadazi Sato

Electrical charge accumulation caused by exposure to a charged particle beam during the formation of latent image pattern can be reduced and thus the positional deviation of the pattern by using a bottom-resist layer comprising a radiation-induced conductive composition. Highly integrated semiconductor device can be made easily and in high yields. The positional deviation can further be reduced by exposing a charge particle beam patterning apparatus substantially simultaneously with an actinic radiation such as ultraviolet light, X-ray, and infrared light.

Method of forming pattern and making semiconductor device using

A photosensitive resin composition comprising (A) an alkaline aqueous solution-soluble novolak resin, (B) a photosensitizer obtained by reacting a polyhydroxy compound with 1,2-naphthoquinone-(2)-diazido-5(or 4)-sulfonyl chloride, and (C) an ultraviolet absorber such as 2-(2'-hydroxy-5'-methylphenyl)-benzotriazole, has a strong absorption against a light of a wavelength of 365 nm and is suitable for producing semiconductor elements, etc.

Photosensitive quinone diazide and resin composition having high

Photosensitive resin composition and pattern formation using the same

A developing solution comprising at least two compounds selected from choline and quaternary ammonium salts is suitable for developing a negative-type photosensitive resin composition with exposure to a smaller light amount.

Process for producing a pattern with negative-type photosensitive

Fine patterns with high degree of resolution and high resistance to etching can be produced by coating a solution of a photosensitive composition comprising (a) an aromatic azide compound and (b) an alkaline-aqueous-solution-soluble polymer on a substrate, exposing predetermined portions of the coated photosensitive composition to ultraviolet light, developing with an alkaline aqueous solution to form a resist pattern, and etching the substrate using said resist pattern as a mask.

Process for producing fine patterns

4'-Azidobenzal-2-methoxyacetophenone is an excellent photosensitive compound and can give a photosensitive composition together with an alkaline-aqueous-solution-soluble polymer which can be insolubilized in an alkaline aqueous solution by photochemical curing with 4'-azidobenzal-2-methoxyacetophenone, and if necessary together with an organic solvent, said composition showing a very small change in viscosity with the lapse of long time.

Photosensitive composition with 4-azido-2'-methoxychalcone

Disclosed are photosensitive resin composition useful for formation of fine patterns on semiconductor devices, magnetic bubble devices, etc. which is highly sensitive and is excellent in developability and which has no problem such as precipitation of azide compounds and remaining azide particles after development and a method for forming fine patterns with said composition. Said photosensitive resin composition comprises (a) at least one polymer compound selected from the group consisting of a novolak resin and a polyhydroxystyrene resin and (b) an azide compound represented by the general formula (1): ##STR1## [wherein X is --N.sub.3 or --SO.sub.2 N.sub.3, Y is ##STR2## R.sup.1 is a lower alkylene such as --CH.sub.2 CH.sub.2 --, --CH.sub.2 CH.sub.2 CH.sub.2 --, or --CH.sub.2 CH.sub.2 OCH.sub.2 CH.sub.2 CH.sub.2 --, a hydroxyalkylene or an aminoalkylene such as ##STR3## (wherein R.sup.4 and R.sup.5 are lower alkyl or hydrogen, R.sup.6 -R.sup.8 are lower alkyl groups, R.sup.3 is hydrogen, a lower alkyl group or --CH.sub.2 CH.sub.2 O).sub.n R.sup.9 wherein n is an integer of 3 or less and R.sup.9 is hydrogen or a lower alkyl group)].

Photosensitive resin composition and method for forming fine patterns

There is disclosed an image-formable resinous composition comprising a poly(olefinsulfone) and a matrix polymer, in which the matrix polymer being a novolac phenol resin obtained from:

Electron beam or X-ray reactive image-formable resinous composition

A photosensitive resin composition comprising (a) 20 to 75 parts by weight of a urethane diacrylate or dimethacrylate compound obtained by reacting trimethylhexamethylene diisocyanate and/or isophorone diisocynate dihydric alcohol and an acrylic or methacrylic monoester of a dihydric alcohol, (b) 20 to 75 parts by weight of a linear polymeric compound having a glass transition temperature of about 40.degree. to 150.degree. C., and (c) a sensitizer and/or a sensitizer system which generate free radicals owing to actinic light, is excellent in heat resistance, resistance to thermal shock and solvent resistance, and is suitable for forming a soldering mask. Further, a photosensitive element produced by forming a layer of the above-mentioned composition on a support gives a protective coating film excellent in heat resistance, resistance to thermal shock and solvent resistance, and is particularly suitable for a soldering mask.

Soldering mask formed from a photosensitive resin composition and a

A photo-curable coating composition for building materials which comprises

Photo-curable coating compositions for building materials

A water-dispersible epoxy modified alkyd resin produced by reacting (A) 0-50 parts by weight of oil or oil fatty acid, (B) 10-50 parts by weight of polyhydric alcohol, (C) 0-25 parts by weight of monobasic acid having 6 to 18 carbon atoms, (D) 15-70 parts by weight of polybasic acid having 4 to 10 carbon atoms or its anhydride, (E) 5-25 parts by weight of polyoxyalkylene glycol having a molecular weight of 600 to 20,000, and (F) an epoxy compound, wherein the ratio of the hydroxyl groups to the carboxyl groups in the components (A) through (E) is 0.625-1.8 and the amount of the component (F) is 3-50 parts by weight per 100 parts by weight of the total weight of the components (A) through (E), can provide water-dispersible coatings having improved drying characteristics and water resistance as well as corrosion resistance.

Water-dispersible epoxy modified alkyd resins

A photosensitive composition for a photoresist, which comprises (A) a compound having the following general formula: ##STR1## wherein Z is a cyclic dibasic acid anhydride moiety, R.sup.1 is an alkylene group having 1 to 3 carbon atoms, R.sup.2 is hydrogen or methyl, and R.sup.3 is hydrogen, methyl, ethyl or -CH.sub.2 X in which X is chlorine or bromine, (B) a photopolymerization sensitizer, (C) a polymer being capable of giving a film-forming property, (D) a chain transfer agent and (E) a thermal polymerization inhibitor; and a laminated photosensitive element which has a substantially dry photosensitive layer of the photosensitive composition. The composition and element are capable of giving a minute resist pattern which is excellent as an etching resist or metal plating resist and can be readily removed after etching or metal plating.

Monofunctional monomer-containing photosensitive composition for

It is herein proposed to laminate a film onto a convex-concaved solid surface in a vacuum to accomplish tight contact between the film and the solid surface. The apparatus includes an air tight housing in which lamination press rolls are arranged, wherein feeding-in and feeding-out of materials such as a base plate and a film for lamination are effected through air tight roll assemblies incorporated in the wall structure of the air tight housing.

Method of an apparatus for producing film-laminated base plates

A resist image, which is excellent in adhesiveness and high in physicochemical strengths, can be obtained by using as a resist material a resin composition having such properties that when it is exposed to actinic rays, a latent image (cure-precursor) is formed therein, and when it is subjected to subsequent heating, only the latent image portion is selectively cured. An example of the above-mentioned resin composition is a latently curable epoxy resin composition composed essentially of (A) an epoxy resin prepolymer and (B) a compound having in the molecule at least two groups represented by the formulas (I) and/or (II), ##STR1## wherein R.sup.1, R.sup.2 and R.sup.3 are individually a hydrogen atom, an alkyl group or aryl group. Another example of the resin composition is a curable resin composition composed mainly of photopolymerization sensitizers and N-methylolacrylamide derivatives represented by the formula, ##STR2## wherein R is a hydrogen atom or a substituted or unsubstituted alkyl group having 1 to 4 carbon atoms; and R' is a hydrogen atom or a methyl group.

Image forming curable resin compositions

A photosensitive resin composition consisting essentially of (A) a photo-polymerizable unsaturated compound having at least two terminal ethylene groups, (B) a reactive linear high molecular weight compound having in its side chain one or two functional groups selected from the class consisting of tetrahydrofurfuryl group and N-alkoxymethylcarbamoyl group, (C) a sensitizer capable of initiating polymerization of the above unsaturated compound upon irradiation with active rays, (D) a compound having at least two epoxy groups, and (E) a potential or latent curing agent for epoxy resins. The photosensitive resin composition can give a protective film excellent in solvent resistance, chemical resistance, heat resistance and mechanical strengths, and hence can be used in the production of printed circuit boards and the precision-processing of metals.

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Hitachi, Japan

Asao Isobe