Rodel Holdings, Inc.

Warner-lambert Company

Rohm and Haas Electronic Materials Cmp Holdings, Inc.

Arun Vishwanathan

David Shidner

David B James

Lee Melbourne Cook

Peter A Burke

John V H Roberts

Joseph K So

Magdy Malak Abdel-Malik

Angel M Orama

Nick Steve D'Ottavio

Vipul Bhupendra Dave

An improved pad and process for polishing metal damascene structures on a semiconductor wafer. The process includes the steps of pressing the wafer against the surface of a polymer sheet in combination with an aqueous-based liquid that optionally contains sub-micron particles and providing a means for relative motion of wafer and polishing pad under pressure so that the moving pressurized contact results in planar removal of the surface of said wafer, wherein the polishing pad has a low elastic recovery when said load is removed, so that the mechanical response of the sheet is largely anelastic. The improved pad is characterized by a high energy dissipation coupled with a high pad stiffness. The pad exhibits a stable morphology that can be reproduced easily and consistently. The pad surface resists glazing, thereby requiring less frequent and less aggressive conditioning. The benefits of such a polishing pad are low dishing of metal features, low oxide erosion, reduced pad conditioning, longer pad life, high metal removal rates, good planarization, and lower defectivity (scratches and Light Point Defects).

Polishing pads for chemical mechanical planarization

An improved pad and process for polishing metal damascene structures on a semiconductor wafer. The process includes the steps of pressing the wafer against the surface of a polymer sheet in combination with an aqueous-based liquid that optionally contains sub-micron particles and providing a means for relative motion of wafer and polishing pad under pressure so that the moving pressurized contact results in planar removal of the surface of said wafer, wherein the polishing pad has a low elastic recovery when said load is removed, so that the mechanical response of the sheet is largely anelastic. The improved pad is characterized by a high energy dissipation coupled with a high pad stiffness and hydrolytic stability.

Hydrolytically stable grooved polishing pads for chemical mechanical planarization

An improved pad and process for polishing metal damascene structures on a semiconductor wafer. The process includes the steps of pressing the wafer against the surface of a polymer sheet in combination with an aqueous-based liquid that optionally contains sub-micron particles and providing a means for relative motion of wafer and polishing, pad under pressure so that the moving pressurized contact results in planar removal of the surface of said wafer, wherein the polishing pad has a low elastic recovery when said load is removed, so that the mechanical response of the sheet is largely anelastic. The improved pad is characterized by a high energy dissipation coupled with a high pad stiffness. The pad also exhibits a stable morphology that can be reproduced easily and consistently. The pad surface has macro-texture that includes perforations as well as surface groove designs The surface groove designs have specific relationships between groove depth and overall pad thickness and groove.area and land area. The pad of this invention resists glazing, thereby requiring less frequent and less aggressive conditioning. The benefits of such a polishing pad are low dishing of metal features, low oxide erosion, reduced pad conditioning, longer pad life, better slurry distribution and waste removal from the pad surface, high metal removal rates, good planarization, and lower defectivity (scratches and Light Point Defects).

Grooved polishing pads for chemical mechanical planarization

A non-stick chewing gum base containing from about 2 to 25% of a plasticized proteinaceous material and a combination of gum base materials, absent elastomer solvent and wax, which render a chewing gun composition non-stick with respect to non-porous surfaces, such as denture materials, as well as common surfaces such as floors, and including porous surfaces such as carpets.

Non-stick chewing gum base

A polishing pad made of polymeric material has an improved surface layer which is provided by treating a surface of the polishing pad with a chemical solvent. Solubility parameter is used to select a suitable chemical solvent. The treated polishing pad can be conditioned in substantially less time than an untreated pad.

Polymeric polishing pad having improved surface layer and method of making same

Process for the formation of a plasticized proteinaceous material in which a plasticizer component is selectively matched with a protein component to form a blend. The blend is heated under controlled shear conditions to produce the plasticized proteinaceous material having the plasticizer component uniformly distributed within the protein component. The plasticized proteinaceous material is used for a variety of purposes including the production of gums and confectionery compositions.

Growing community of inventors

Wilmington, DE, United States of America

Arun Vishwanathan