Applied Materials, Inc.

Computervision Corporation

Anthony F White

Abhilash J Mayur

Satheesh Kuppurao

Brian L Haas

Eugene Smargiassi

Lewis A Stern

Douglas P Simms

Carl W Miller

A system and a method for reducing the rate at which volatile contaminants are deposited onto one or more optical components of a substrate processing system are disclosed. A purge fluid is introduced into the processing system at an interior surface of the processing system. A flow of purge fluid is produced across the interior surface to form a contaminant-entraining barrier between a source of the volatile contaminants and the one or more optical components and thereby reduce the rate at which volatile contaminants are deposited onto the optical components of the system. The purge fluid is substantially removed from the processing system.

Reducing the deposition rate of volatile contaminants onto an optical component of a substrate processing system

A substrate support, such as an edge ring, includes an inner portion, and an outer portion contiguous with the inner portion and extending radially outward therefrom. The inner portion has a raised annular extension forming a ridge for supporting a substrate.

Substrate support for a thermal processing chamber

An apparatus for processing substrates includes a chamber, a substrate transfer element for transferring a substrate to and from the chamber, and a substrate support for receiving and holding a substrate within the chamber. The apparatus also includes multiple pins positioned and configured to be received by respective holes in the chamber bottom and moveable between a retracted position and an extended position. A pin actuation system is provided for moving the pins between the retracted position and the extended position. The pin actuation system controls the velocity at which the pins move and varies the speed of the pins by accelerating or decelerating at particular points during the pin cycle. A reduction in the cycle time is facilitated by accelerating the lift pins to relatively high speeds and then slowing the pins down prior to their arrival at locations where the substrate or wafer may be damaged. The throughput of the chamber can be increased, the likelihood of damage to the substrate can be reduced, and bouncing of the substrate while supported by the pins can be reduced.

Processing chamber with rapid wafer exchange

A non-contacting, non-clogging, electro-mechanically operated marking device or inker for continuous or intermittently marking a semiconductor wafer die is disclosed together with a method of operating the device. The marking device has an ambient pressure ink reservoir within which is mounted a thin, capillary filament guide tube. A length of filament such as, fishline, is positioned within the tube and secured at one end to the plunger of a solenoid. The distal end of the filament is driven out of the capillary tube by the solenoid to force a small amount of the marking fluid or ink out of the reservoir and onto the die without the filament contacting the die. The solenoid coil is energized by a current pulse having a first current level and a second current level that is less than the first current level. The second current level provides a short holding current for the solenoid to prevent spattering of the marking fluid.

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Cupertino, CA, United States of America

Anthony F White