Intel Corporation

General Electric Company

Anju Narendra

Harry Kirk Mathews, Jr

Ravi Rajamani

Jonathan Carl Thatcher

Bruce Gordon Norman

Sal Albert Leone

John Harry Down

Scot Goerutiz

Kimberly A Ryglelski

Kevin E Heldrich

Brook D Ferney

Matthew A Ring

Methods of controlling polishing of wafers are disclosed. In one aspect, a method may include measuring one or more pre-polish thicknesses of one or more layers of a wafer. The one or more layers may then be polished. Then a post-polish thickness of a layer of the wafer may be measured. Polishing may be controlled by using feed-forward control with the one or more pre-polish thicknesses and by using feed-back control with the post-polish thickness. Machine-accessible software to perform such methods are also disclosed as are systems in which such methods may be implemented.

Wafer polishing control

A fault detection and isolation system for detecting leaks and blockages in a fluid handling system having at least one component through which fluid flows includes sensors for measuring fluid conditions upstream and downstream of the component. The sensors generate signals that are representative of the upstream and downstream fluid conditions and are fed to a control algorithm. The control algorithm uses the measured fluid conditions to generate estimates of an inlet state for the component and an outlet state for the component. The control algorithm also calculates innovation sequences for the estimated inlet and outlet states, and then compares the innovation sequences to predetermined thresholds to detect leaks and blockages.

Model-based detection of leaks and blockages in fluid handling systems

Growing community of inventors

Beaverton, OR, United States of America

Anju Narendra