International Business Machines Corporation

Angelo M Giaimo

Paul M Gaschke

Gobinda Das

Steven J Duda

John F Vetrero

Frederick L Taber, Jr

A nonresilient rigid test probe arrangement which is designed for testing the integrity of silicon semiconductor device wafers or chips, and which eliminates pliant conditions encountered by current text fixtures, which are adverse to the attainment of satisfactory test results with rigid probes. The test system interface assembly includes a rigid ceramic substrate which forms a pedestal over which the rigid probe makes electrical contact. A PC board is located on the opposite side of the ceramic substrate. A clamp ring retains the PC board to a test head system with mating precision reference surfaces formed therebetween. Pogo pin connectors extend between the PC board and the test head system. A stiffening element having a control aperture is bolted through the PC board to the clamp ring, all of which form a rigid test probe arrangement.

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Wappingers Falls, NY, United States of America

Angelo M Giaimo