Entegris, Inc.

Freudenberg-nok General Partnership

Andrew Galpin

Christopher J Wargo

Joseph E Smith

Patrick Doering

Rajesh Tiwari

Daniel Wells

Christopher Wargo

A chemical mechanical planarization (CMP) pad conditioning assembly that includes one or more support structures positioned between one or more abrasive regions of the pad conditioning assembly is disclosed. The support structures and abrasive regions can be separated by one or more channels. A top surface of the one or more support structures is not co-planar with the top surface of the abrasive regions of the pad conditioning assembly, and the height of the top surface of the one or more support structures when measured to the pad facing surface of the pad conditioning assembly backing plate is less than the height of the top surfaces of the abrasive regions when measured to the pad facing surface of the pad conditioning assembly.

CMP pad conditioning assembly

A CMP pad conditioner for conditioning a polishing pad. Various embodiments of the disclosure include a plurality of elongated protrusions which work a conditioned surface of a polishing pad at a variety of attack angles as the CMP pad conditioner engages the polishing pad. Because of the elongated geometry of the protrusions, the variety of attack angles will tend to flex the conditioned face of the polishing pad in a multifaceted manner. Such multifaceted manipulation of the conditioned face enhances the cut rate of the conditioner assembly and the removal of debris in the pores of the polishing pad that are residual from the CMP process, to better open the pores of the polishing pad and to better maintain the removal rate in the CMP process.

Chemical mechanical planarization pad conditioner with elongated cutting edges

A pad conditioner for a CMP polishing pad is disclosed that includes a substrate that has a matrixical arrangement of protrusions that have a layer of poly crystalline diamond on at least their top surfaces. The protrusions may have varying shapes and elevations and may comprise a first set of protrusions and a second set of protrusions, the first set of protrusions have a first average height and the second set of protrusions have a second average height, the first average height different from the second average height, a top of each protrusion in the first set of protrusions has a non-flat surface and a top of each protrusion in the second set of protrusions has a non-flat surface.

Chemical mechanical planarization pad conditioner

Chemical mechanical planarization conditioner

A gasket can include a body adapted to form a seal in an engagement region between two members. A first sealing portion can be formed in the body and define a first plane. A second sealing portion can be formed in the body and occupy a space outside of the first plane. A first transition portion is formed between the first and second portions. The first transition portion defines a first width in the engagement region that is greater than a second width defined in the first and second portion adjacent to the first transition portion.

Growing community of inventors

Westford, MA, United States of America

Andrew Galpin