National Technology & Engineering Solutions of Sandia, LLC

Other

Andrew Armstrong

Andrew A Allerman

Robert Kaplar

Daniel F Feezell

Carlos Anthony Sanchez

Albert G Baca

Mary H Crawford

Erica Ann Douglas

Morteza Monavarian

Saadat Mishkat-Ul-Masabih

Andrew Aragon

Jeffrey Steinfeldt

Jack David Flicker

Andrew Binder

Luke Yates

Gregory W Pickrell

Michael L Smith

Vincent M Abate

Jeramy R Dickerson

Brendan P Gunning

A vertical gallium nitride (GaN) PN diode uses epitaxial growth of a thick drift region with a very low carrier concentration and a carefully designed multi-zone junction termination extension to achieve high voltage blocking and high-power efficiency. An exemplary large area (1 mm) diode had a forward pulsed current of 3.5 A, an 8.3 mΩ-cmspecific on-resistance, and a 5.3 kV reverse breakdown. A smaller area diode (0.063 mm) was capable of 6.4 kV breakdown with a specific on-resistance of 10.2 mΩ-cm, when accounting for current spreading through the drift region at a 45° angle.

High voltage gallium nitride vertical PN diode

A method comprises providing a substrate comprising an n-type Al/In/GaN semiconductor material. A surface of the substrate is dry-etched to form a trench therein and cause dry-etch damage to remain on the surface. The surface of the substrate is immersed in an electrolyte solution and illuminated with above bandgap light having a wavelength that generates electron-hole pairs in the n-type Al/In/GaN semiconductor material, thereby photoelectrochemically etching the surface to remove at least a portion of the dry-etch damage.

Removing or preventing dry etch-induced damage in Al/In/GaN films by photoelectrochemical etching

Methods are provided for fabricating a HEMT (high-electron-mobility transistor) that involve sequential epitaxial growth of III-nitride channel and barrier layers, followed by epitaxial regrowth of further III-nitride material through a window in a mask layer. The regrowth takes place on the barrier layer, only in the access region or regions. Devices made according to the disclosed methods are also provided.

Regrowth method for fabricating wide-bandgap transistors, and devices made thereby

Methods are provided for fabricating a HEMT (high-electron-mobility transistor) that involve sequential epitaxial growth of III-nitride channel and barrier layers, followed by epitaxial regrowth of further III-nitride material through a window in a mask layer. In examples, the regrowth takes place over exposed portions of the channel layer in the source and drain regions of the device, and the regrown material has a composition different from the barrier layer. In other examples, the regrowth takes place on the barrier layer, only in the access region or regions. Devices made according to the disclosed methods are also provided.

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Albuquerque, NM, United States of America

Andrew Armstrong