Yangtze Memory Technologies Co., Ltd.

Wuhan Jianghechang Energy and Technology Co., Ltd.

An Zhang

Jianquan Jia

Kaiwei Li

Ying Cui

Yali Song

Kaikai You

Shan Li

Lei Jin

Hongtao Liu

XiangNan Zhao

Xueqing Huang

Meng Lou

Jinlong Zhang

Qiguang Wang

Jianwei Lu

Yuanyuan Min

Xinlei Jia

Bo Xiao

Zhiquan Hu

Shiping Jin

Chuanwu Huang

Bojian Xiao

Fanjun Zeng

In some aspects, a memory device is provided. The memory device includes a plurality of memory strings and a peripheral circuit. One of the memory strings includes memory cells, a select transistor coupled to a select line and a bit line, and a dummy cell coupled to a dummy word line and arranged between the select transistor and the memory cells. The peripheral circuit is coupled to the memory strings and configured to, in a pre-pulse period of a program operation, maintain a first voltage on the select line to retain an on-state of the select transistor and apply a second voltage to the dummy word line to turn off the dummy cell. After applying the second voltage to the dummy word line, the peripheral circuit is further configured to apply a third voltage to the select line to turn off the select transistor.

Method of reducing program disturbance in memory device and memory device utilizing same

A programming method and a semiconductor device are provided. The semiconductor device includes a memory string that includes a plurality of first memory cells and a first dummy cell stacked in sequence, and each first memory cell is connected to a respective word line, and a gate of the first dummy cell is connected to a first dummy word line. The method includes: in a programming phase, applying a first pass voltage to a word line corresponding to a first unprogrammed memory cell, wherein the first unprogrammed memory cell is an unprogrammed memory cell of the plurality of first memory cells separated from a to-be-programmed memory cell by a first preset number of first memory cells; and after applying the first pass voltage to the word line corresponding to the first unprogrammed memory cell, applying a programming voltage to the word line corresponding to the to-be-programmed memory cell.

Programming method for semiconductor device and semiconductor device

A memory device includes a memory string and a control circuit coupled to the memory string. The memory string includes a top select gate, word lines, and a bottom select gate. The control circuit is configured to, in an erasing operation, apply an erasing voltage to the memory string, apply a verifying voltage to at least one word line of the word lines after applying the erasing voltage to the memory string, and apply a first turn-on voltage to the bottom select gate, before applying the verifying voltage to the at least one word line.

Memory device and erasing and verification method thereof

A method for operating a memory is disclosed. The memory includes a first group of word lines, a second group of word lines, a first dummy word line, and a second dummy word line. The first dummy word line and the second dummy word line are between the first group of word lines and the second group of word lines. A first pass voltage is applied to the first dummy word line and applying a second pass voltage to the second dummy word line. A program voltage is applied to a selected word line, wherein a condition is met: a first voltage difference between the first pass voltage and a first threshold voltage of a first dummy cell corresponding to the first dummy word line is different from a second voltage difference between the second pass voltage and a second threshold voltage of a second dummy cell corresponding to the second dummy word line.

Method and memory used for reducing program disturbance by adjusting voltage of dummy word line

When programming and verifying a memory device which includes a plurality of memory cells and a plurality of word lines, a first coarse programming is first performed on a first memory cell among the plurality of memory cells which is controlled by a first word line among the plurality of word lines, and then a second coarse programming is performed on a second memory cell among the plurality of memory cells which is controlled by a second word line among the plurality of word lines. Next, a first coarse verify current is used for determining whether the first memory cell passes a coarse verification and a second coarse verify current is used for determining whether the second memory cell passes a second coarse verification, wherein the second coarse verify current is smaller than the first coarse verify current.

Method of programming and verifying memory device and related memory device

A memory device includes a memory string and a control circuit coupled to the memory string. The memory string includes a top select gate, word lines, a bottom select gate, and a P-well. The control circuit is configured to, in an erasing operation, apply an erasing voltage to the P-well, apply a verifying voltage to a selected word line of the word lines after applying the erasing voltage to the P-well, and apply a first turn-on voltage to the bottom select gate, starting after applying the erasing voltage to the P-well and before applying the verifying voltage to the selected word line.

A memory device includes bit lines, and a cell array including strings, each of which includes memory cells, a select cell coupled to a respective one of the bit lines, and a dummy cell between the select cell and the memory cells. The memory device also includes a select line coupled to the select cells, a dummy word line coupled to the dummy cells, word lines each coupled to a respective row of the memory cells, and a controller coupled to the cell array. The controller is configured to drive a voltage on the dummy word line from a first level to a second level lower than the first level. The controller is also configured to drive a voltage on the select line from the first level to the second level, such that the voltage on the select line reaches the second level after the voltage on the dummy word line reaches the second level. The controller is further configured to, after the voltage on the select line reaches the second level, drive a voltage on a selected word line of the word lines from the second level to a third level higher than the first level to program the memory cells coupled to the selected word line.

A three-dimensional (3D) memory device includes a substrate, an alternating conductive/dielectric stack disposed on the substrate, an epitaxial layer disposed on the substrate, a blocking layer disposed on the epitaxial layer and surrounded by the alternating conductive/dielectric stack, a trapping layer disposed on and surrounded by the blocking layer, a tunneling layer disposed on and surrounded by the trapping layer, and a semiconductor layer disposed on and in contact with the epitaxial layer and partially disposed on and surrounded by the tunneling layer.

Three-dimensional memory device and manufacturing method thereof

A memory includes an upper deck and a lower deck. The upper deck includes a first upper dummy word line. The lower deck includes a first lower dummy word line. A method for reducing program disturbance of the memory includes adjusting a first upper bias voltage applied to the first upper dummy word line and/or a first upper threshold voltage of the first upper dummy word line to adjust a first difference between the first upper bias voltage and the first upper threshold voltage; and adjusting a first lower bias voltage applied to the first lower dummy word line and/or a first lower threshold voltage of the first lower dummy word line to adjust a second difference between the first lower bias voltage and the first lower threshold voltage.

A memory device includes a top select cell, a top dummy cell and a string of memory cells. The top select cell has a first terminal coupled to a bit line and a control terminal coupled to a top select line. The top dummy cell has a control terminal coupled to a top dummy word line. The string of memory cells has control terminals coupled to respective word lines. A method operating the memory device includes prior to a program operation, applying a pre-pulse voltage to the top dummy word line, the top select line and the bit line while applying a low voltage to the word lines, and then sequentially applying the low voltage to the top dummy word line, the top select line and the bit line while applying the low voltage to the word lines.

Method of sequentially biasing bias lines in memory device for program disturbance reduction and memory device utilizing same

A memory device includes a memory array including memory strings. Each memory string includes a plurality of top memory cells, a plurality of bottom memory cells, and one or more dummy memory cells between the top memory cells and the bottom memory cells. The memory device also includes a plurality of word lines respectively coupled to gate terminals of the top memory cells and the bottom memory cells, and one or more dummy word lines respectively coupled to gate terminals of the one or more dummy memory cells. The memory device further includes a control circuit configured to program a target memory cell coupled to a selected word line of the plurality of word lines. To program the target memory cell, the control circuit is configured to apply a biased dummy word line pre-pulse signal to the one or more dummy word lines in a pre-charge period prior to a programming period.

Non-volatile memory device and control method

A memory device includes a plurality of memory blocks, and a control circuit. A selected memory block of the plurality of memory blocks comprises a top select gate, a bottom select gate, a plurality of word lines, a common-source line, and a P-well. The control circuit performs an erasing and verification method, wherein the erasing and verification method includes erasing the selected memory block during an erasing stage; and maintaining the bottom select gate to be turned on during a maintaining period before the top select gate are turned on during a verification stage.

A three-dimensional (3D) memory device and a manufacturing method thereof are provided. The method includes the following steps. An alternating dielectric stack is formed on a substrate. An opening is formed penetrating the alternating dielectric stack in a thickness direction of the substrate. A blocking layer is formed on a sidewall of the opening. A trapping layer is formed in the opening, and the trapping layer is formed on the blocking layer. The trapping layer includes a lower portion and an upper portion disposed above the lower portion. A thickness of the upper portion in a horizontal direction is greater than a thickness of the lower portion in the horizontal direction. The thickness distribution of the trapping layer is modified for improving the electrical performance of the 3D memory device.

A non-volatile memory device is disclosed. The non-volatile memory device includes a memory array, a plurality of word lines, a plurality of dummy word lines, a first control circuit and a second control circuit. The plurality of word lines are connected to a plurality of top memory cells and bottom memory cells of a memory string of the memory array. The plurality of dummy word lines are connected to a plurality of dummy memory cells connected between the plurality of top memory cells and bottom memory cells. The first control circuit is configured to apply a bit line pre-pulse signal to the bit line during a pre-charge period. The second control circuit is configured to apply a selected word line signal to a selected word line, apply an unselected word line signal to unselected word lines and apply a negative pre-pulse signal to the plurality of dummy word lines.

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Wuhan, China

An Zhang