Advanced Metrology Systems LLC

Alexei Maznev

Alexander Mazurenko

Peter Rosenthal

Michael Gostein

Zhuoyun Li

Carlos A Duran

The invention represents an improved method of measuring trenches on semiconductor wafers with optical spectroscopy. According to the described method, it is possible to characterize not only depth but also shape of the trench. The advancement is achieved by improved Effective Medium Approximation-based modeling of the optical response of trench structures.

Method of measuring deep trenches with model-based optical spectroscopy

The present invention uses ISTS to measure trenches with near- or sub-micron width. The trenches can be etched in a thin film on in a silicon substrate. One step of the method is exciting the structure by irradiating it with a spatially periodic laser intensity pattern in order to generate surface acoustic waves. Other steps are diffracting a probe laser beam off the thermal grating to form a signal beam; detecting the signal beam as a function of time to generate a signal waveform; determining surface acoustic wave phase velocity from the waveform; and determining at least one property of the trench structures based on the dependence of surface acoustic wave phase velocity on the parameters of the structure.

Method of measuring sub-micron trench structures

The present invention measures a structure including multiple narrow metallic regions, each being disposed between neighboring regions comprising a second, non-metallic material. One step of the method is exciting the structure by irradiating it with a spatially periodic excitation field made up of excitation stripes in order to generate a thermal grating. Other steps are diffracting a probe laser beam off the thermal grating to form a signal beam; detecting the signal beam as a function of time to generate a signal waveform; and determining at least one property of the structure based on a thermal component of the signal waveform.

Method of determining properties of patterned thin film metal structures using transient thermal response

In an opto-acoustic measuring device for thin films and solid surfaces, the probe beam is split into a first probe beam portion and a second reference beam portion. The splitting of the probe beam is achieved using a phase mask that also splits the excitation beam. The probe beam is aligned using a retro-reflector on a motorized stage to control the beam angle. Excitation and probe/reference beams are overlapped at the sample surface. The first probe beam portion gets diffracted by material disturbances generated by excitation beams. The diffracted part of the first probe beam portion is collinear with the second reference beam portion, resulting in heterodyning. The heterodyne signal measured by the detector is analyzed in order to determine thickness and/or other properties of a thin film or solid surface. The invention improves magnitude and reproducibility of the opto-acoustic signal which results in enhanced precision of measurements.

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Natick, MA, United States of America

Alexei Maznev