Nitto-denko Corporation

Alex Enriquez Cayaban

Martin John McCaslin

Szu-Han Hu

Yasunari Ooyabu

Visit Thaveeprungsriporn

Voon Yee Ho

Jason Aquinde Gomez

Shuichi Wakaki

Vladimir Aleksic

Yukimasa Kawato

A suspension flexure is provided. The suspension flexure includes a steel layer, a polyimide layer above the steel layer, and a copper layer on the polyimide layer comprising a plurality of dual opposing cantilevered copper pads.

Dual opposing cantilever pads of suspension flexure

A hard drive gimbal trace circuit includes: a stainless steel gimbal strut (SGST) configured to support a transducer and nullify a natural pitch angle of a flexure from mechanical-coarse adjustment of the SGST; traces forming a trace structure, and being plastically deformed at a high strain region from the mechanical-coarse adjustment of the SGST; and a first protrusion and a second protrusion being at least partially disposed under the high strain region. The SGST has an edge which is disposed on the transducer side to be spaced apart from the traces in the high strain region and extends substantially parallel to the traces. The first protrusion and the second protrusion extend from the edge in an orthogonal direction to an extending direction of the traces and across the traces, and are disposed side by side in the extending direction of the traces.

Copper residual stress relaxation reduction means for hard disk drive slider gimbals

A single layer dynamic loop is provided. A single layer dynamic loop includes a set of traces divided by a slit on the single layer dynamic loop, wherein the set of traces are divided into a first region and a second region; and wherein the single layer dynamic loop is folded along the slit to move at least part of the first region in relation to the second region.

Dynamic loop with fold

An Extended Circuit Integrated Suspension (ECIS) design and manufacture thereof, to allow for circuit elements to be disposed onto the load beam on the opposite side of the flexure circuit. An Extended Circuit Integrated Suspension (ECIS) may include a load beam; a flexure circuit comprising a plurality of traces; and a connection portion which connects the load beam laterally to the flexure circuit. The load beam, the flexure circuit, and the connecting portion may be formed as a single component from a single panel, and the connection portion is oriented so that the connection portion is folded to place the flexure circuit onto a first side of the load beam. Applications for the use of the extended circuit are many, and a semi-collocated micro-actuator (SCLMA) is illustrated for example.

Circuit integrated suspension and method of manufacture thereof

Described is a preamp flex cable for use in a hard drive. The flex cable incorporates a stiffener layer operable to provide a mechanical support, an insulating layer provided over the stiffener layer and having at least one via provided therein to expose the stiffener layer, and at least one conductive layer provided over the insulating layer. The at least one conductive layer forms an electrical circuit and at least one heat removing element that extends through the via and establishes a contact with the stiffener layer.

Ground vias for enhanced preamp heat release in hard disk drives

Disclosed are various techniques for reduction of the magnitude of the residual stress in the HDD gimbal circuits, or more specifically, the residual plastic strain. Various trace structures of the gimbal circuits as well as stress suppressors are utilized to achieve the reduction of the residual stress in the circuit.

A substrate for mounting a preamp chip thereupon, fabricated using a stiffener layer made of a conductive material; an insulating layer provided over the circuitry area of the substrate; a circuitry made of a conductive material provided over the insulating layer; and a flap which is an extension of the stiffener layer having no insulating layer provided thereupon. The flap is fabricated to fold over the preamp chip to remove heat therefrom.

Method for manufacturing a substrate supporting an integrated circuit chip

Described is a preamp flex cable for use in a hard drive. The flex cable incorporates a stiffener layer operable to provide a mechanical support, an insulating layer provided over the stiffener layer and having at least one via provided therein to expose the stiffener layer, and at least one conductive layer provided over the insulating layer. The at least one conductive layer forms an electrical circuit and at least one heat removing element that extends through the via and establishes a contact with the stiffener layer. In one implementation, the heat removing element includes a rectangular plate having a recessed center portion and an edge portion. The recessed center portion protrudes through the at least one via in the insulating layer to mechanically couple with the stiffener. In another implementation, the heat removing element includes first portion and second rectangular portions. The first portion protrudes through the at least one via in the insulating layer to thermally couple with the stiffener and the second portion is disposed over the insulating layer, such that the second portion can be thermally coupled to the preamp.

Heat transfer for a hard-drive pre-amp

Inspection windows are cut or formed into the tail section of the flexure circuit tail in a hard disk drive Head Gimbal Assembly (HGA), or CIS, to enable visual inspection of the alignment of the CIS to the head preamp circuit, or FPC. The holes are made in the steel backing and base polyimide, and are positioned between adjacent conductive pads. In addition to facilitating visual inspection, the windows also enable rework of solder. Additionally, solder wicking holes may also be provided in the conductive pads and/or the polyimide and steel backing.

Growing community of inventors

Fremont, CA, United States of America

Alex Enriquez Cayaban