U.S. Philips Corporation

North American Philips Corporation

Metrologix, Inc.

Alan H Achilles

Guillermo L Toro-Lira

Alan C Abel

Kevin M Monahan

Philip R Rigg

Nolan V Frederick

Improved techniques for imaging high-aspect-ratio structures such as contact holes utilize two signal detection sub-systems, one optimized for imaging at the top and another optimized for imaging at the base of submicrometer structures. These detection systems produce signals that can be combined in real-time to produce an image which resembles the 'extended focus' images obtained with confocal optical microscopes. Unlike the confocal image, however, the resulting image has the inherent linearity and resolution characteristics of electron-beam technology. Using the new approach, the signal, rather than exhibiting a near-zero minimum at the base of the structure as is typical of the prior art, exhibits its maximum at the base of the structure, allowing high-precision measurement with no need for extrapolation.

Detection system for precision measurements and high resolution

The present invention describes a loading system for high speed loading of wafers, such as semiconductor wafers, into vacuum chambers for various applications such as inspection or processing using, for example, a SEM. This system provides low contamination from atmospheric conditions both on loading and unloading the wafers.

High speed wafer handling method

High speed wafer handler

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San Jose, CA, United States of America

Alan H Achilles